Transcription of Surface Mount Placement Equipment Characterization
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Surface Mount Placement Equipment Characterization
IPC-9850 ASurface MountPlacement EquipmentCharacterizationDeveloped by the SMT Component Placement EquipmentSubcommittee (5-41) of the Assembly Equipment Committee(5-40) of IPCU sers of this publication are encouraged to participate in thedevelopment of future :IPC3000 Lakeside Drive, Suite 309 SBannockburn, Illinois60015-1249 Tel 847 847 :IPC-9850 - July 2002 Table of Contents1 .. Future .. Characterization Limitations .. Binding Requirements .. Test Components .. Test Panels .. Methods.
Surface Mount Placement Equipment Characterization 1 INTRODUCTION 1.1 Scope This standard establishes the procedures to characterize the capability of surface mount assembly equipment in specification documents, as well as in documentation used to verify a specific machine’s placement capability and confor-
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