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System Level ESD Expanded - JEDEC

System Level ESD Expanded 2 Fred Bahrenburg Dell Tim Cheung - RIM Heiko Dudek Cadence Marcus Dombrowski Volkswagen Johannes Edenhofer Continental / BSH Stephan Frei University of Dortmund (Germany) Masamitsu Honda Impulse Physics Lab Japan Mike Hopkins Hopkins Technical Vsevolod Ivanov Auscom John Kinnear - IBM Frederic Lefon Valeo Christian Lippert Audi Wolfgang Pfaff Bosch Patrice Pelissou EADS Tuomas Reinvuo Nokia Marc Sevoz EADS Pasi Tamminen - Nokia / Technical University of Tempere Matti Uusumaki Nokia / Semtech Wolfgang Wilkening Bosch Rick Wong - Cisco Advisory Board Advisors Industry Council 2012 OEM-Mainframe 20% OEM-Auto 20% University 10% Consultants 15% OEM- Mobile 20% EDA Vendor 15% 3 PREFACE The topic of System Level ESD was addressed by the Industry Council in two parts: Part I: Common Misconceptions and Recommended Basic Approaches Published as JEDEC Document JEP161 Part II: System Level ESD.

•Tools for System ESD DesignAdvanced Topics •Future of System Level ESD 6 Industry Council 2013 . What is a System? IC Component IC Component IC Component System with External IC Pins System with Internal IC Pins A system consists of embedded ICs and other electronic components to

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