Transcription of System Level ESD Expanded - JEDEC
{{id}} {{{paragraph}}}
System Level ESD Expanded 2 Fred Bahrenburg Dell Tim Cheung - RIM Heiko Dudek Cadence Marcus Dombrowski Volkswagen Johannes Edenhofer Continental / BSH Stephan Frei University of Dortmund (Germany) Masamitsu Honda Impulse Physics Lab Japan Mike Hopkins Hopkins Technical Vsevolod Ivanov Auscom John Kinnear - IBM Frederic Lefon Valeo Christian Lippert Audi Wolfgang Pfaff Bosch Patrice Pelissou EADS Tuomas Reinvuo Nokia Marc Sevoz EADS Pasi Tamminen - Nokia / Technical University of Tempere Matti Uusumaki Nokia / Semtech Wolfgang Wilkening Bosch Rick Wong - Cisco Advisory Board Advisors Industry Council 2012 OEM-Mainframe 20% OEM-Auto 20% University 10% Consultants 15% OEM- Mobile 20% EDA Vendor 15% 3 PREFACE The topic of System Level ESD was addressed by the Industry Council in two parts: Part I: Common Misconceptions and Recommended Basic Approaches Published as JEDEC Document JEP161 Part II: System Level ESD.
•Tools for System ESD Design •Advanced Topics •Future of System Level ESD 6 Industry Council 2013 . What is a System? IC Component IC Component IC Component System with External IC Pins System with Internal IC Pins A system consists of embedded ICs and other electronic components to
Domain:
Source:
Link to this page:
Please notify us if you found a problem with this document:
{{id}} {{{paragraph}}}