Transcription of TB3101 - Microchip Technology
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2013 Microchip Technology 1TB3101 INTRODUCTIONThe MCP2561 is Microchip s second generation CANtransceiver. Although major improvements have beenmade, resulting in increased EMC performance andmuch lower current consumption, the differences inusing the MCP2561 versus the MCP2551 are 1 shows the differences in MCP2561 can be used as a drop-in replacementfor the MCP2551 if the differences listed in Ta b l e 1 1:PINOUT DIFFERENCESThe MCP2561 also adds a new leadless package type,8LD 3x3 DFN, allowing for smaller form factor packagerequirements. This package features pin 9, ExposedThermal Pad, and has the same pinout as the PDIPand SOIC further information on these differences and on thenew models available, please refer to Table :Wilhelm LeichtfriedMicrochip Technology , SOICVDDVSSRXDCANHCANL12348765 SPLITSTBYTXDMCP2551 PDIP, SOICVDDVSSRXDCANHCANL12348765 VREFRSTXDTABLE 1:MIGRATION CONSIDERATIONSD ifferenceFunction/ReferenceConsideration MCP2551 MCP2561 Pin 5 VREFSPLITThe name of the pin is different but the function is the same.
2013 Microchip Technology Inc. DS90003101A-page 3 TB3101 FIGURE 3: VREF/SPLIT USED, MODE CONTROLLED BY MICROCONTROLLER CONCLUSION This document describes the aspects to be taken into account before migrating from the MCP2551 to the
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