Transcription of Technical Data Sheet ABLEBOND 8175 - Bonding Source
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Technical Data Sheet ABLEBOND 8175 - Bonding Source
TechnicalDataSheet ABLEBOND 8175 May-2011 PRODUCTDESCRIPTIONABLEBOND 8175provides thefollowingproductcharacteristics:Techn ologyEpoxyAppearanceSilverCureHeatcurePr oduct Benefits Electricallyconductive Thermallyconductive Stressabsorbing Pb-freealternativeto solder StencilorscreenprintableApplicationDieat tachABLEBOND 8175isdesignedforsolderreplacementinmicr oelectronicinterconnectapplications. Thisadhesivemaybeusedwiththickfilmmetall izationsortraditionalprintedcircuitboard surfaces. Itiscapableofresolvingfinepitchresolutio n( inch) whenprintedusingeithera stainlesssteelmeshscreenora 8175meetstherequirementsofMIL-STD-883, ( rpm) ,BrookfieldCP51, 25 C, mPa s(cP):Speed5 rpm55,000 WorkLife@25 C, weeks2 ShelfLife@-40 C, year1 FlashPoint- SeeMSDSTYPICALCURINGPERFORMANCECureSched ule30 minutes@150 C AlternativeCureSchedule60 minutes@150 C(forbondlines<1 milthick) AlternativeCureSchedule260 minutes@130 C (timeandtemperature)mayvarybasedoncustom ers'experienceandtheirapplicationrequire ments,aswellascustomercuringequipment,ov enloadingandactualoventemperatures.
Technical Data Sheet ABLEBOND 8175 May-2011 PRODUCT DESCRIPTION ABLEBOND 8175 provides the following product characteristics: Technology Epoxy Appearance Silver
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