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The Development of a Qualification Temperature Profile for Lead- free ReflowSolderingV. Kirchner, C. Klein, M. Beintner, I. Brauer, R. Holz and H. FeufelRobert Bosch GmbHSchwieberdingen/Reutlingen, GermanyAbstractA reflow soldering Profile has been developed for SnAgCu solder paste regarding mass production requirements,measurement and furnace tolerances as well as reliability requirements of automotive industry. The Profile is alimiting line between the Qualification of the semiconductor device and the assembly process to avoid harmfulstressing of the components. Measurements were performed on a test printed circuit board which was especiallydesigned for such investigations. Regarding non-hermetic solid state surface mount devices three Temperature classeshave been identified with peak temperatures of 245 C, 250 C and 260 C.
The Development of a Qualification Temperature Profile for Lead-free Reflow Soldering V. Kirchner, C. Klein, M. Beintner, I. Brauer, R. Holz and H. Feufel ... To achieve a reliable solder joint the conventional reflow soldering process with SnPb solder paste is
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