tHE MUltIPREP™ SYStEM - Allied High Tech …

UNEQUALLEDRESULTSIN ALL OF THESESAMPLEPREPARATIONAPPLICATIONSBACKSI DE POLISHING PRECISIONCROSS-SECTIONINGPRE-FIB THINNINGPARALLEL DELAYERINGTEM WEDGE/PLAN-VIEW POLISHINGtHEMUltIPREP SYStEMtHEMUltIPREPSYStEMtMThe MultiPrep SYStEM enables precise semiautomatic sample preparationof a wide range of materials for microscopic (optical, SEM, FIB, TEM, AFM,etc.) include parallel polishing, angle polishing, site-specific polishing orany combination thereof. It provides reproducible results by eliminatinginconsistencies between users, regardless of their micrometers (pitch and roll) allow precise sample tilt adjustments relativeto the abrasive plane. A rigid Z-indexing spindle maintains the predefinedgeometric orientation throughout the grinding/polishing process. Digitalindicators enable quantifiable material removal, which can be monitored real-time, or preset for unattended operation. Variable speed rotation and oscillationmaximize use of the entire grinding/polishing disc and minimize load control expands its capability to handle a range of small(delicate) to large SYSTEMS ample holding fixtures areattached using a Cam-Lockingsystem, allowing quick, easyfixture removal for sampleinspection and exact re-positioning throughout thepolishing RISERThe Spindle Riser raises thesample without disturbing thesample position settings.

PARALLEL DELAYERING The MultiPrep is ideal for parallel polishing. The most common application is for IC delayering, but it is also used to thin PCB’s, substrates, compound

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