32 IEEE TRANSACTIONS ON ELECTRONICS PACKAGING ...

COUREY et al.: TIN WHISKER ELECTRICAL SHORT CIRCUIT CHARACTERISTICS—PART I 33 considers the following factors: conductor spacing, lead con-tent in tin plating, process by which the tin was deposited, tin thickness, materialdirectly beneaththetin, substrate controlling

  Electrical, Part, Short, Circuit, Characteristics, Whisker, Tin whisker electrical short circuit characteristics part

Photonic Integrated Circuit (PIC) Device Structures ...

and construct electronic devices onto a single CMOS chip. Photonic integrated circuits (PICs) exist as the optical analog to integrated circuits; however, in place of transistors, PICs consist of numerous scaled

  Devices, Electronic, Circuit, Electronic devices

Assessing and Mitigating Radiation Effects in Xilinx FPGAs

This research was carried out at the Jet Propulsion Laboratory, California Institute of Technology, and was sponsored by the National Aeronautics and Space Administration Electronic Parts and Packaging (NEPP) Program.

  Assessing, Radiation, Effect, Xilinx, Mitigating, Propulsion, Jet propulsion, Assessing and mitigating radiation effects in xilinx

Radiation Effects Assessment of MRAM Devices - NASA

Radiation Effects Assessment of MRAM Devices Mohamed Elghefari Jet Propulsion Laboratory Pasadena, California Steve McClure Jet Propulsion Laboratory Pasadena, California Jet Propulsion Laboratory California Institute of Technology Pasadena, California JPL Publication 08-19 5/08 .

  Assessment, Devices, Radiation, Effect, Propulsion, Ramm, Jet propulsion, Radiation effects assessment of mram devices

S-311-S-819 - Resistor, Fixed, Foil (Managanin) Power ...

Surface Mount CODE 311 SUPERVISORY APPROV~: I I I Ronald Chinnapongse ~~ Ir~7 ... fOil, precIsion, current sensing resistor In a surface mounted package. This 4-terminal (two power J-shaped and two sense gull-wing-shaped) resistor is intended for use in ... Marking shall in no way interfere with or obscure any of the original manufacturer's ...

  Surfaces, Mount, Marking, Resistor, Surface mount

S-311-S-821 - Resistor, Fixed, Foil (Manganin), Chip ...

fOil, precIsion, current sensing resistor In a surface mounted package. This chip ... Marking shall in no way interfere with or obscure any of the original manufacturer's marking. b. The number of lines shall be at discretion of the test facility or laboratory. ... Foil (Manganin), Chip, Power, Current Sensing, Surface Mount ...

  Surfaces, Mount, Marking, Resistor, Surface mount

Mechanical Properties and Microstructure Investigation Of ...

Sn-Ag-Cu alloy is considered the preferred substitute for tin-lead solder in reflow applications due to its relatively low melting temperature, and superior mechanical properties and solderability compared with other lead free solders.

  Mechanical, Free, Deal, Properties, Flowers, Solder, Lead free, Mechanical properties, Lead solder

IEEE TRANSACTIONS ON ELECTRONICS PACKAGING …

COUREY et al.: TIN WHISKER ELECTRICAL SHORT CIRCUIT CHARACTERISTICS—PART II 43 Fig. 4. Schematic diagram for the tin whisker test station instrumentation. Re-produced from [4]. Fig. 5. Tin whisker test station probing area close up.

  Electrical, Transactions, Packaging, Electronic, Part, Short, Circuit, Characteristics, Whisker, Transactions on electronics packaging, Whisker electrical short circuit characteristics part

Temperature Dependent Dielectric Properties of ...

Temperature Dependent Dielectric Properties of Polycrystalline 96%Al 2O 3 Liang-Yu Chen1 and Gary W. Hunter2 1Ohio Aerospace Institute/NASA Glenn Research Center at Lewis Field, Cleveland, OH 44135 2NASA Glenn Research Center at Lewis Field, Cleveland, OH 44135 Abstract Polycrystalline Al 2O 3 substrates have been proposed and tested for high ...

  Temperatures, Dependent, Properties, Dielectric, Polycrystalline, Temperature dependent dielectric properties of, Temperature dependent dielectric properties of polycrystalline

Space Grade Requirements for Electrical Connectors

GSFC-S-311-P-10, Subminiature, electrical and coaxial contact, electrical, connector. Military Specifications and Standards MIL-STD-1344 Test Methods for Electrical Connectors MIL-STD-202: Test Methods for Electronic and Electrical Component parts MIL-C-5015, Circular, threaded, AN type, electrical, connector.

  Electrical, Requirements, Grade, Space, Space grade requirements for electrical

Spill Prevention, Control and Countermeasure Plan (SPCC ...

(MFL) or ultrasonic thickness (UT) measurements, vacuum box testing, and weld inspection in order to adequately assess the container condition. While frequent external visual inspections can often be completed by trained facility personnel, the requirement to conduct regular integrity tests or inspections may involve hiring specialized personnel

  Ultrasonic, Thickness, Ultrasonic thickness

Piezoelectric Simulations - COMSOL Multiphysics

A composite piezoelectric ultrasonic transducer is analyzed. An eigenfrequency analysis is ... Thickness Shear Mode Quartz Oscillator A quartz oscillator, operated in the thickness shear mode, is simulated. The model shows how to set up the co-ordinate system correctly for AT cut quartz and to model the response of

  Ultrasonic, Thickness, Piezoelectrics, Piezoelectric ultrasonic

NON-DESTRUCTIVE TESTING - Anasayfa

thickness; radiation protection. No subsurface flaws not for porous materials Dye penetrate Surface flaws No subsurface flaws not for porous materials Ultrasonic Subsurface flaws Material must be good conductor of sound. Magnetic Particle Surface / near surface and layer flaws Limited subsurface capability, only for ferromagnetic materials.

  Testing, Ultrasonic, Thickness, Non destructive testing, Destructive

SCHOTT BOROFLOAT 33 - University of Chicago

Coated BOROFLOAT® 33 is supplied in the 3.3 mm thickness and 1150 x850 mm sheet size. We will be happy to provide information about other thickness and sizes plus information about other coatings upon request. 2.2 Thermal semi-toughening: The resistance of BOROFLOAT® 33 to thermal and mechanical loads is improved by thermal semi-toughening.

  Thickness, Borofloat

Understanding Bend Tests - MCAA

in the through-thickness direction. Qualification test plates can be prepared with the weld groove preparation parallel to the direction of rolling. The length of the bend specimens extracted from such a test plate will be perpendicular to the rolling direction (Figure 2). This means when the specimen is bent, straining is perpendicular

  Thickness

Procedure Qualification Record (PQR) - WPSAmerica

Thickness mm (in) Area sq. mm (in) Ultimate Tensile Load kg (lb) Ultimate Unit Stress MPa (psi) Character of Failure and Location . TA1 25,1 30 753 36212 Kg 471 (MPa) Ductile out Weld TA2 25,1 30 753 36712 Kg 477 (Mpa) Ductile out Weld TB1 …

  Qualification, Record, Procedures, Thickness, Procedure qualification record

API Standard 1104

API Weldi TWENTY-FI This standa high-quality using appro equipment. This standa and socket used in the crude petro dioxide, nitr distribution and in-servi

IPC-J-STD-001G: Requirements for Soldered Electrical and ...

IPC J-STD-001G Requirements for Soldered Electrical and Electronic Assemblies Developedby the J-STD-001Task Group(5-22a)of the Soldering Subcommittee(5-22) of the Assembly& JoiningCommittee(5-20)