Transcription of TM Micro Commercial Components MMBT3904
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TM Micro Commercial Components MMBT3904
MMBT3904 NPN General Purpose AmplifierSOT-23 Suggested SolderPad LayoutFeatures Capable of 350mWatts of Power Dissipation and 200mA Characteristics @ 25 C Unless Otherwise SpecifiedSymbolParameterMinMaxUnitsOFF CHARACTERISTICS V(BR)CEOC ollector-Emitter Breakdown Voltage* (IC= , IB=0)40 VdcV(BR)CBOC ollector-Base Breakdown Voltage (IC=10 Adc, IE=0)60 VdcV(BR)EBOE mitter-Base Breakdown Voltage (IE=10 Adc, IC=0) Collector Cutoff Current (VCB=30 Vdc, VBE= )50 nAdc ICEXC ollector Cutoff Current (VCE=30 Vdc, VBE= )50 nAdcON CHARACTERISTICS hFEDC Current Gain* (IC= , VCE= ) (IC= , VCE= ) (IC=10mAdc, VCE= ) (IC=50mAdc, VCE= ) (IC=100mAdc, VCE= )40701006030300 VCE(sat)Collector-Emitter Saturation Voltage (IC=10mAdc, IB= ) (IC=50mAdc, IB= ) VBE(sat) Base-Emitter Saturation Voltage (IC=10mAdc, IB= ) (IC=50mAdc, IB= ) CHARACTERISTICS fTCurrent Gain-Bandwidth Product (IC=10mAdc, VCE=20 Vdc, f=100 MHz) 300 MHz CoboOutput Capacitance (VCB= , IE=0, f= ) CiboInput Capacitance(VBE= , IC=0, f= ) NF Noise Figure(IC=100 Adc, VCE= , RS= f=10Hz to ) CHARACTERISTICS td Delay Time(VCC= , VBE= tr Ri)
MMBT3904 NPN General Purpose Amplifier SOT-23 Suggested Solder Pad Layout Features • Capable of 350mWatts of Power Dissipation and 200mA Ic. DIMENSIONS
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