Where is the Packaging Technology Drifting? - KMEPS

Company Confidential I 0506 CLEE 1 1 Where is the Packaging Technology drifting ? Choon Lee | EVP & CTO Company Confidential I 0506 CLEE 2 2 Smartphone Market Growth Rate 335 $ 314$ ASP 267$ 2013 2014 2018 Source : IDC Company Confidential I 0506 CLEE 3 3 History says (1) < 1990s : Computing Era : Thermal fast memory Graphic performancene Super BGA uBGA FCBGA < 2014 : Smartphone Era : High density memory Formfactor Sensors PoP WLCSP Low cost > 2014 : Portable Era : Integration/Cost/Formfactor Module/ Company Confidential I 0506 CLEE 4 4 History says(2) Package-on-Package WLCSP SOIC Low pin High pin & Integration As Multi-function pager City phone / PCS Feature Phone Smart Phone QFP PBGA Company Confidential I 0506 CLEE 5 5 New Trends in Package NFC WLCSP MLF MCU POP fcCSP TSV WiFi Bluetooth LGA Memory AP Heartrate MEMS Microphone GPS Inertial E-Compass Miniaturization Integration Company Confidential I 0506 CLEE 6 6 Mob

Company Confidential I 0506 CLEE 13 Bump Layout and Density – Case Study 2 2 layer conversion with fine pitch Cu pillar Device Name Solder Bump Cu Pillar

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