Transcription of ZCU111 Evaluation Board - Xilinx
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ZCU111 Evaluation Board - Xilinx
ZCU111 Evaluation BoardUser GuideUG1271 ( ) October 2, 2018 ZCU111 Board User Guide2UG1271 ( ) October 2, HistoryThe following table shows the revision history for this Summary10/02/2018 Version Discharge CautionAdded new electrostatic discharge : DDR4 SODIMM SocketRevised first : DDR4 Component MemoryAdded reference to Plug-in Card InterfaceRevised paragraph following Figure 3-20 and added reference to Appendix D, in Appendix DRevised bulleted D-3 Added a Version Data Converter ClockingRemoved RF Clocking Overview 3-18 Added capacitor 3-18 and Table 3-19 Added optional RFMC and SYSREF capacitor Module ConnectorsAdded note and reference to SNIA Technology Affiliates Version Xilinx FeedbackZCU111 Board User Guide3UG1271 ( ) October 2, of ContentsRevision History..2 Chapter1: IntroductionOverview .. 6 Additional Resources.
ESD can damage electronic comp onents when they are improper ly handled, and can result in total or intermittent failures. Always follow ESD-prevention procedures when removing and ... TI DP83867IRPAP, Wurth 7499111221A 30 13 U22, U23 I2C0 (MIO 14-15), expander TI TCA6416APWR,
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