Package Soldering
Found 10 free book(s)
SMB - Diodes Incorporated
www.diodes.comSurface Mount Package Case Material: Molded Plastic, UL Flammability Rating 94V-0 Terminals: Finish - Matte Tin Plated Leads, Solderable per MIL-STD-202, Method 208 Weight: 0.096 grams (Approximate) Max Soldering Temperature +260°C for 30 secs as per JEDEC J-STD-020 Package View Package Outline Dimensions SMB SMB
SMA - Diodes Incorporated
www.diodes.comSurface Mount Package Case Material: Molded Plastic, UL Flammability Rating 94V-0 Terminals: Finish - Matte Tin Plated Leads, Solderable per MIL-STD-202, Method 208 Weight: 0.064 grams (Approximate) Max Soldering Temperature +260°C for 30 secs as per JEDEC J-STD-020 Package View Package Outline Dimensions SMA
Optocoupler, Phototransistor Output, Dual Channel, SOIC-8 ...
www.vishay.comTotal package dissipation ambient (2 LEDs and 2 detectors, 2 channels) Ptot 350 mW Storage temperature Tstg-55 to +150 °C Operating temperature Tamb-55 to +100 °C Soldering time from 260 °C (1) Tsld 10 s ELECTRICAL CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified) PARAMETER TEST CONDITION SYMBOL MIN. TYP. MAX. UNIT INPUT
2.7V 4-Channel/8-Channel 10-Bit A/D Converters with SPI ...
cdn-shop.adafruit.comJan 02, 2008 · Soldering temperature of leads (10 seconds).....+300°C ESD Protection On All Pins (HBM).....≥ 4kV † Notice: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rati ng only and functional operation of ... Thermal Package Resistances
SOT23 - NXP
www.nxp.comWave soldering footprint SOT023_fw Package life cycle status REL Major version date 18-9-2008 Minor version date 6-7-2012 Security status COMPANY PUBLIC Modified date 28-11-2012 Issue date 16-3-2006 Web publication date 28-11-2012 Initial web publication date 11-3-2011 Customer specific indicator N
MOUNTING AND HANDLING GUIDELINES FOR …
aosmd.comthe time-temperature specification of the package is not exceeded in the soldering operation. References 1. Sanjay Havanur, Application Note: AN101-1 , June, 2007 This document contains preliminary data; supplementary data may be published at a later date. Alpha and Omega Semiconductor reserves the right to make changes at any time without notice.
Package Information : SOP8
fscdn.rohm.comSOP8 Package Information 7. Soldering conditions 7.1 Recommended temperature profile for reflow 7.2 Recommended condition for wave soldering Preheating temperature : 120 °C to 150 °C Preheating time : 60 sec MAX Soldering temperature : 260 °C ± 3 °C Soldering time : …
Package dimensions MSOP, SSOP, TSSOP-A2 - iC-Haus
www.ichaus.deFor additional information on component handling, preconditioning and soldering conditions, refer to the relevant iC-Haus customer information files, available separately. iC-Haus Application Guide More Package Info. Title: Package dimensions MSOP, SSOP, TSSOP-A2.indd Created Date: 8/4/2006 1:07:11 PM ...
LT1963A - 1.5A, Low Noise, Fast Transient Response LDO ...
www.analog.comlead based finish tape and reel part marking* package description temperature range LT1963AET-1.5 LT1963AET-1.5#TR LT1963AET-1.5 5-Lead Plastic TO-220 –40°C to 125°C LT1963AET-1.8 LT1963AET-1.8#TR LT1963AET-1.8 5-Lead Plastic TO-220 –40°C to 125°C
PACKAGE INFORMATION 1. PACKAGE CLASSIFICATIONS
img.ozdisan.comPACKAGE INFORMATION 1. PACKAGE CLASSIFICATIONS 1 1. PACKAGE CLASSIFICATIONS 1.1 Packaging Trends In recent years, marked advances have been made in the electronics field. One such advance has been the progression from vacuum tubes to transistors and finally, to ICs. ICs themselves have been more highly integrated into LSIs, …