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Sac305 Lead Free Solder

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sac305 Lead-free solder alloy

sac305 Lead-free solder alloy

aimsolder.com

SAC305 LEAD-FREE SOLDER ALLOY FEATURES Liquidus 220°C (428°F) Compatible with all Flux Types Excellent Wetting Speed Excellent Solderability and Spreading Reduced Bridging Versus Sn-Cu Alloys Manufactured with AIM Electropure™ Technology Complies with IPC J-STD-006 DESCRIPTION SAC305 lead-free alloy contains 96.5 % tin, 3% silver, and 0.5%

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Solderability Tests for Printed Boards - IPC

Solderability Tests for Printed Boards - IPC

www.ipc.org

Table 4-3 Lead-Free Reflow Parameter Requirements ... 15 Table 4-4 Pass/Fail Criteria for Specific Surface Finishes Using Eutectic SnPb ..... 17 Table 4-5 Pass/Fail Criteria for Specific Surface Finishes Using SAC305 Solder ..... 18 Table …

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