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069-0135-K SPEC, REGULATED SUBSTANCES Sept2018

069-0135-K SPEC, REGULATED SUBSTANCES Sept2018

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isn’t a homogeneous material because mechanical processes could separate the different materials. In this case, restrictions apply to each of the separated materials individually. • A semiconductor package contains many homogeneous materials that include the mold compound, die attach adhesive, die coatings, bonding wires, lead frame, and

  Homogeneous

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