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Solderability ANSI/J-STD-002 Board flex(SMD) AEC-Q200-005 Terminal strength AEC-Q200-006 Solder Reflow and Rework Recommendations Profile Feature Pb-Free Assembly Average Ramp-Up Rate (Tsmax to Tp) 3°C℃/second max Preheat : Temperature Min (Tsmin) Temperature Max (Tsmax) Time (tsmin to tsmax) ...

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