Acceptability of Electronic Assemblies

← Back to document page

5.2.3 Reflow of Solder Paste 5-10 5.2.4 Nonwetting 5-11 5.2.5 Dewetting 5-12 5.2.6 Excess Solder 5-13 5.2.6.1 Solder Balls/Solder Fines 5-13 5.2.6.2 Bridging 5-15 5.2.6.3 Solder Webbing 5-16 5.2.7 Disturbed Solder 5-17 5.2.8 Fractured Solder 5-18 5.2.9 Solder Projections 5-19 5.2.10 Lead Free Fillet Lift 5-20

  Free, Deal, Flowers, Solder, Lead free