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Chapter 23: Wafer Level Packaging

Chapter 23: Wafer Level Packaging

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Wafer level packaging (WLP) came into its own around the year 2000. Prior to that time, the majority of packaging processes were mechanical, such as grinding, sawing, wire bonding, etc. The packaging process steps were performed predominantly after die singulation, as illustrated by the simplified process flow of figure 1. Figure 1.

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