Etch rates for micromachining processing-part II ...
T. ARGET. M. ATERIALS. Polysilicon LPCVD Undoped: Undoped polycrystalline sil-icon deposited in a Tylan low-pressure chemical-vapor deposi-tion (LPCVD) furnace with recipe SiH sccm, temperature , pressure mtorr. Deposited on a wafer with 100 nm of thermal oxide on it to enable interferometric thickness measurements.. Undoped poly, which has
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