Lead-Free Solder Joint Voiding: The Causes are …
Lead-Free Solder Joint Voiding: The Causes are Starting to Surface by Mark Currie, the electronics group of Henkel While there are conflicting opinions on the effect of voiding in lead-free solder joints in
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Lead-Free Selective Soldering: The Wave of the …
www.circuitnet.comPage 1 Lead-Free Selective Soldering: The Wave of the Future By Bob Klenke, ERSA, Inc. The European perspective on waste management and recycling as described in the European Union’s Waste of
Halogens and Halides – Jan 08 - Circuitnet
www.circuitnet.comHere’s one of the exceptions I mentioned: non-ionic halogenated compounds can also be used as raw materials in soldering fluxes to help keep the activators working as the
Improved Bond reliability through the use of …
www.circuitnet.comMotivation for study Improve Wire Bond Interconnect Reliability • Increase Pull Strength of Stitch Bond • Improve Failure Mode from Destructive Pull
Indium-Lead Solder Alloys for Reliable Gold …
www.circuitnet.comIndium Corporation Tech Paper From One Engineer To Another ® 3 Other Common Indium Alloys Commonly used Pb-free indium alloys include pure …
IEEE P1687 Internal JTAG (IJTAG) Tutorial
www.circuitnet.comstandard on-chip architecture can interface to a standard IEEE 1149.1 boundary-scan standard Test Data Register (TDR). Isolating the P1687 IJTAG architecture from the requirements of the interface leading off the chip ensures the portability of embedded instrument intellectual property (IP) as well as any vector IP that may be associated with them.
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