Qualification and Performance Specification for Rigid ...
† Multilayer printed boards with PTHs with or without buried/blind vias/microvias. † Active/passive embedded circuitry printed boards with distributive capacitive planes and/or capacitive or resistive compo-nents. † Metal core printed boards with or without an external metal heat frame, which may be active or non-active.
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Qualification and Performance Specification for Rigid ...
www.ipc.org† Multilayer printed boards with PTHs with or without buried/blind vias/microvias. † Active/passive embedded circuitry printed boards with distributive capacitive planes and/or capacitive or resistive components. † Metal core printed boards with or without an external metal heat frame, which may be active or non-active.