TROUBLESHOOTING MOLDING PROBLEMS
Molding Troubleshooting Guide Bond Readout Bond readout is a surface distortion similar to a hump or sink that occurs over a bond line Probable Cause Material Process • Mismatch of compliance between outer panel, inner panel and adhesive • Incompatible thermal expansion coefficients between the SM and the adhesive
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TROUBLESHOOTING MOLDING PROBLEMS
www.idicomposites.com407 South 7th Street | Noblesville, Indiana 46060 | (317) 773-1766 | www.idicomposites.com Page 3 / 44 Molding Troubleshooting Guide Blisters A blister is a delamination that produces a bulge on the surface of the part.
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