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IPC-9252B: Requirements for Electrical Testing of ...

IPC-9252 BRequirements forElectrical Testingof UnpopulatedPrinted BoardsDeveloped by the Electrical Continuity Testing Task Group (7-32c) of the Product Assurance Committee (7-30) of IPCU sers of this publication are encouraged to participate in the development of future :IPCS upersedes:IPC-9252A - November 2008 IPC-9252 - February 2001 IPC-ET-652A - October 1990 Table of Contents1 .. of the Proper Test Level .. Level 22 APPLICABLE .. Organization for Standardization(ISO) .. National Standards Institute(ANSI) .. 23 TERMS AND (As Agreed Between User andSupplier) .. Terms .. Adjacency .. Adjacency Distance .. Horizontal Adjacency Vertical Layer Adjacency .. Automated Design/Manufacturing(CAD/CAM) Net List .. Points/Midpoints .. (Flying) Plate Fixture .. Testing .. Indirect Test by Signature Comparison .. Isolation Resistance.

electrical test(s) on all unpopulated printed boards. The testing of printed boards with embedded components (e.g., resistors, capacitors, etc.) is not addressed in this document revision. 1.1 Purpose Electrical testing verifies that the conductive networks on the printed boards are interconnected according to the design requirements.

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Transcription of IPC-9252B: Requirements for Electrical Testing of ...

1 IPC-9252 BRequirements forElectrical Testingof UnpopulatedPrinted BoardsDeveloped by the Electrical Continuity Testing Task Group (7-32c) of the Product Assurance Committee (7-30) of IPCU sers of this publication are encouraged to participate in the development of future :IPCS upersedes:IPC-9252A - November 2008 IPC-9252 - February 2001 IPC-ET-652A - October 1990 Table of Contents1 .. of the Proper Test Level .. Level 22 APPLICABLE .. Organization for Standardization(ISO) .. National Standards Institute(ANSI) .. 23 TERMS AND (As Agreed Between User andSupplier) .. Terms .. Adjacency .. Adjacency Distance .. Horizontal Adjacency Vertical Layer Adjacency .. Automated Design/Manufacturing(CAD/CAM) Net List .. Points/Midpoints .. (Flying) Plate Fixture .. Testing .. Indirect Test by Signature Comparison .. Isolation Resistance.

2 Leakage .. Plated Hole .. Populated Board .. Resistance Measuring Method .. Time Domain Reflectometer (TDR) .. 54 TEST Test .. Resistive Continuity Testing .. Indirect Continuity Testing by SignatureComparison .. Testing .. Resistive Isolation Testing .. Indirect Isolation Testing by SignatureComparison .. Parameter Matrix .. Other than Continuity and (Re- Testing ) .. Records, Traceability and Retention .. Traceability .. 85 TEST PROGRAM Data .. CAM Data CAD Data Test .. 86 Electrical TEST CERTIFICATION of Conformance (C of C).. Example of a Test Certificate of Conformance(C of C) .. 9 APPENDIX A Other Tests and 10 FiguresFigure 1-1 Automatic Test Equipment (ATE)Selection Criteria .. 1 Figure 3-1 Adjacency .. 3 Figure 3-2 Adjacency Distance Example .. 3 Figure 3-3 Horizontal Layer Adjacency.

3 3 Figure 3-4 Line of Sight Adjacency .. 4 Figure 3-5 Vertical Layer Adjacency .. 4 Figure 3-6 Test for Midpoint Classification .. 5 Figure 4-1 Resistive Continuity 6 Figure 4-2 Resistive Continuity 7 TablesTable 4-1 Requirements by Test 6 September 2016 IPC-9252 BvRequirements for Electrical Testing ofUnpopulated Printed Boards1 SCOPEThis document is intended to assist in selecting the test analyzer, test parameters, test data, and fixturing required to performelectrical test(s) on all unpopulated printed Testing of printed boards with embedded components ( , resistors, capacitors, etc.) is not addressed in this PurposeElectrical Testing verifies that the conductive networks on the printed boards are interconnected according tothe design test does not ensure that the printed board can be assembled or that the printed board meets all of the customer srequirements. Many physical characteristics of the conductors (dimensional accuracy, solder mask, conductor geometry andnomenclature registration, presence of holes, etc.)

4 Can t be determined by Electrical test. Other checks should be employedto confirm these IntroductionElectrical Testing of printed boards ensures that the printed board conforms to the Electrical designrequirements. This document defines different levels of Testing available in order to achieve this purpose. In selecting theappropriate test level, technology, equipment, and associated fixturing, a suitable compromise between productivity, features,and costs can be costs associated with Electrical Testing can vary dramatically. Costs alone, however, should never be the only criteria forselecting the appropriate test level and equipment. As shown in Figure 1-1, many other important areas require consider-ation. For example, spacing and density of a printed board design may be of paramount importance to one user, whileanother may be concerned with Testing parameters and service reliability.

5 A careful examination of all areas of concern andhow they may affect each other, not just how they perform individually, is therefore significant. Whatever the selection cri-teria may be, qualifying benchmarks should be performed on known 1-1 Automatic Test Equipment (ATE) Selection CriteriaAT EPURCHASINGCONTINGENCIESDIAGNOSTICSCOSTM AINTENANCEFAULTLOCALIZATIONFUTUREAPPLICA TIONSDENSITYCAPABILITIESDOCUMENTATIONSUP PORTSERVICESPRODUCTTHROUGHPUTFIXTURINGPR OGRAMMINGELECTRICALPARAMETERSS eptember 2016 IPC-9252B1


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