Technical Data Sheet QMI 529 HT - icproto.com

1 AmericasHenkel Corporation15350 Barranca ParkwayIrvine, CA 92618949-789-2500 EuropeHenkel loctite Adhesives House, Wood Lane EndHemel HempsteadHertfordshire HP2 4RQ+ loctite Hong Kong Island Place Tower510 King's Road, North PointHong Kong+ trademarks, except where noted are the property of Henkel Corp. Technical data SheetQMI 529 HTApril 2004 NOT FOR PRODUCT SPECIFICATIONSTHE Technical INFORMATION CONTAINED HEREIN IS INTENDED AS REFERENCE ONLY. PLEASE CONTACT TECHNICALSERVICE FOR ASSISTANCE AND RECOMMENDATIONS ON SPECIFICATIONS FOR THIS DESCRIPTIONQMI 529HT is a highly silver filled, conductive adhesivedesigned to provide high (6-7 W/m K) thermal conductivity andexcellent electrical conductivity for attachment of integratedcircuits and components to metallic leadframes.

2 The materialis hydrophobic and stable at high temperatures. Thesefeatures produce void-free bond lines with excellent adhesivestrength to a wide variety of metals and ceramic surfaces,including copper, silver-plated copper, preplated leadframes(NiPdAu) and Alloy 42. A package or device manufacturedwith QMI 529HT will have high resistance to delamination andpopcorning after multiple exposures to lead-free solder reflowtemperatures. The QMI 529HT is designed to achieve UPHsseveral orders of magnitude higher than conventional ovencured adhesives. Maximum productivity is realized through in-line cure, either on the diebonder using a post diebond heateror on the wirebonder preheater. This product and its use may be covered by patent 5,717,034 and byone or more pending patent applications.

3 TYPICAL APPLICATIONSThis product was developed as soft-solder replacement or forapplications that require higher thermal or high PROPERTIEST ypical ValueTest MethodViscosity, 5 rpm @ 25 C, cP18500TM547 Thixotropic @ 25 C, hours24TM592 Shelf life @-40 C12TM589 Specific Shear (300mil x 300 mil dieon Ag-Cu) Average kgf @25 C57TM558 Average kgf @245 C21TM558 Extractable Ion Content, ppm Na, K, Cl, F 20TM449 Glass Transition (Tg), of Thermal Expansion(TMA) Below Tg, ppm/ C53TM433 Above Tg, ppm / C156TM433 Volume Resistivity, modulus @ 25 C, above characteristics and values represent typical materialproperties only and are not to be used for material specificationpurposes. To generate a specification for this product, please contactour Quality Manager and request a copy of the current AND HANDLINGQMI 529HT is supplied in syringes and should be stored at-40 C.

4 Please review Henkel s current Die Attach HandlingProcedure for additional details on thawing and AND BONDLINE CONTROLQMI 529HT adhesion is tested using 1 mil bondline thinner bondlines increase stress, please call yournearest loctite Electronic Material Technical service engineerfor consultation in cases where bondlines less than 1 mil aredesired. Optimization of diebonding parameters is stronglyrecommended to consistently meet target bondline SCHEDULEQMI 529HT can be cured using a variety of times andtemperatures, depending on the specific cure equipment. QMI529HT may be cured in conventional ovens or using snap cureequipment. One of the following cure schedules Cure (single zone): 60 seconds @ 185oCSnap Cure (7-zone): 10 seconds each @ 170 C,170 C, 170 C, 200 C, 200 C, 200 C, 200 COven cure: 30 min. @ 185oCFor higher adhesion use: 30 min @ 200 220oCFor cure schedule recommendations, please contact yournearest loctite Electronic Materials INFORMATIONFor safe handling information on this product, consult theMaterial Safety data Sheet , (MSDS).

5 Note The data contained herein are furnished for information onlyand are believed to be reliable. We cannot assumeresponsibility for the results obtained by others over whosemethods we have no control. It is the user's responsibility todetermine suitability for the user's purpose of any productionmethods mentioned herein and to adopt such precautions asmay be advisable for the protection of property and of personsagainst any hazards that may be involved in the handling anduse thereof. In light of the foregoing, Henkel Corporationspecifically disclaims all warranties expressed or implied,including warranties of merchantability or fitness for aparticular purpose, arising from sale or use of HenkelCorporation s products.

6 Henkel Corporation specificallydisclaims any liability for consequential or incidentaldamages of any kind, including lost profits. The discussionherein of various processes or compositions is not to beinterpreted as representation that they are free fromdomination of patents owned by others or as a license underany Henkel Corporation patents that may cover suchprocesses or compositions. We recommend that eachprospective user test his proposed application before repetitiveuse, using this data as a guide. This product may be coveredby one or more United States or foreign patents or patentapplications.