Transcription of Inner Layer Bond Strength of Multilayer Printed …
1 1 ScopeThis method is used to determine the Inner layerbond Strength of either a metal conductor or an Applicable DocumentsNone3 Test SpecimenLaminate dielectric with or without cop-per foil, prepared in accordance with Figure tensile tester Model #FM 10 or Preparation for TestingDuring layup of the testspecimen panel, place TEDLAR (or other suitable material)release sheets that will disallow lamination at one end of eachspecimen, providing a 13 mm x 25 mm non-bonded tab. Thetabs can then be used as gripping areas to perform bondstrength testing. One can then evaluate the laminate-to-laminate bonds and the laminate-to-copper foil bond through-out the finished panel an equal number of release sheets on the outersurface of the layup, covering all surfaces, except where inter-nal release sheets have been placed.
2 This is essential to pro-vide proper and uniform lamination lamination and cure, cut the panel into 25 mmstrips, as shown in Figure 1, and remove internal steps and are not used, it will be neces-sary to chemically or thermally remove resins from the outer25 mm, in order to provide a tab to initiate cutting the samples to the designated size and lift-ing the 25 mm strip for testing, the Layer to be tested shall befastened into the clamping device of the tensile tester, allow-ing the wire connecting the clamp to the tensile tester to pullthe specimen vertically within 5 tester is then started. A force is applied in the verti-cal direction at a rate of 51 mm per minute until delamination( bond Strength ) is completed or the Inner Layer minimum load is then recorded using the following for-mula: bond Strength of the conductor width =25mmsample widthx total loadIPC-2-4-40-1 Figure 1 Laminate DielectricThe Institute for Interconnecting and Packaging Electronic Circuits2215 Sanders Road Northbrook, IL 60062-6135 IPC-TM-650 TEST METHODS Layer bond Strength of Multilayer PrintedCircuit BoardsDate10/87 RevisionOriginating Task GroupN/AMaterial in this Test Methods Manual was voluntarily established by Technical Committees of the IPC.
3 This material is advisory onlyand its use or adaptation is entirely voluntary. IPC disclaims all liability of any kind as to the use, application, or adaptation of thismaterial. Users are also wholly responsible for protecting themselves against all claims or liabilities for patent referenced is for the convenience of the user and does not imply endorsement by the
