Transcription of 鍚鬚問題Tin Whisker - dyfenco.com.tw
1 Tin Whisker (1) " " 1998 NASA Relay 10% (Compressive Inner Stress) " " (Conformal Coating) (Root Cause) Cu6Sn5 IMC ( 34) Organic Impurity No Bend Compressive Bend 245 microns 312 microns 7 microns 12 microns 6 microns 6 microns 27.
2 Lucent Tech SEM Satin Sn 28. 5 (2) m 10mm 50 C RH50% ( m ) " "(Tensile Stress) Motorola Shipley 29. ( ) 55 C~85 C 500 Cu6Sn5 IMC Motorola ECWC 2003 Lucent Cu6Sn5 IMC ( 34) Ni3Sn4 IMC Tin Whiskers Filament , Nodule Column, Needle Mound( ) ( 27 ) ( ) (Matte Tin Satin Bright ) 10 m 170 C (Annealing)1 IMC 30 (Grain Size)
3 2-5 1 m 31. 245 m 312 m 7 m (Tensile Stress) 12 m Lucent Tech 32. (Screw Dislocation) (3) Lucent Tech 2002 APEX Cu6Sn5 IMC (SnO/SnO2) ( 34) 34. Cu6Sn5 IMC IMC SnO ( Lau ) (Simulation) ) (60 C 93%RH NEMI 1008 ) ( 55 C 85 C 1000 ) (Mechanism) (Inner Stress Residue Stress) (Dislocation 32)
4 Cu6Sn5 IMC IMC Cu6Sn5
