Technical Data Sheet ABLEBOND 84-1LMI - …

1 TechnicalDataSheet ABLEBOND 84-1 LMIM arch-2009 PRODUCTDESCRIPTIONABLEBOND 84-1 LMIprovides thefollowingproductcharacteristics:Techn ologyEpoxyAppearanceSilverCureHeatcurePr oduct Benefits Electricallyconductive Lowbleed 84-1 LMI dieattachadhesiveisdesignedfor microelectronicchipbonding. Thisadhesiveisidealforapplicationbyautom aticdispenser 84-1 LMImeetstherequirementsofMIL-STD-883, ( rpm) ,BrookfieldCP51, 25 C, mPa s(cP):Speed5 rpm30,000 WorkLife@25 C, weeks2 ShelfLife(fromdateof manufacture): @5 C, months3 @-10 C, months6 @-40 C, year1 TYPICALCURINGPERFORMANCECureSchedule1 hour@150 C AlternativeCureSchedule2 hours@125 C (timeandtemperature)mayvarybasedoncustom ers'experienceandtheirapplicationrequire ments,aswellascustomercuringequipment,ov enloadingandactualoventemperatures.

2 TYPICALPROPERTIESOFCUREDMATERIALP hysicalProperties:Coefficientof ThermalExpansion:BelowTg,ppm/ C55 AboveTg,ppm/ C150 GlassTransitionTemperature (Tg) by TMA, C103 ThermalConductivity, , ppm:Chloride(Cl-) 20 Sodium(Na+) 20 Potassium(K+) 10 WaterExtractConductivity, mhos/cm10 WeightLoss @300 C,% :VolumeResistivity, :2 X 2 mmSidie, kg-f,Substrate@25 CAg/Culeadframe19 Lap ShearStrength@25 C:SubstrateMPapsiAlto Al121500 GENERALINFORMATIONF orsafehandlinginformationonthisproduct,c onsulttheMaterialSafetyDataSheet,(MSDS). containerto , C,theadhesiveshouldnotbere-frozen.

3 TDSABLEBOND 84-1 LMI, March-2009 Temperature, CSyringe Thaw Time, , ' theadhesiveisleftoutat 25 Cbeyondtherecommendedworklife. drylocation. : -40 C. Storagebelowminus(-)40 Corgreaterthanminus(-)40 Donotreturnproducttotheoriginalcontainer . additionalinformationis required,pleasecontactyourlocalTechnical ServiceCenterorCustomerServiceRepresenta tive. Conversions( Cx )+ 32= FkV/mmx V/milmm/ inchesN x lbN/mmx lb/inN/mm x 145= psiMPax 145= psiN m x lb inN mx lb ftN mm oz inmPa s= cPNoteThedatacontainedhereinarefurnished forinformationonlyandarebelievedtobereli able.

4 Wecannotassumeresponsibilityfortheresult sobtainedbyothersoverwhosemethodswehaven ocontrol. It istheuser'sresponsibilitytodeterminesuit abilityfortheuser' ,HenkelCorporationspecificallydisclaimsa llwarrantiesexpressedorimplied,including warrantiesofmerchantabilityorfitnessfora particularpurpose,arisingfromsaleoruseof HenkelCorporation sproducts. HenkelCorporationspecificallydisclaimsan yliabilityforconsequentialorincidentalda magesofanykind,includinglostprofits. Thediscussionhereinofvariousprocessesorc ompositionsisnottobeinterpretedasreprese ntationthattheyarefreefromdominationofpa tentsownedbyothersorasa licenseunderanyHenkelCorporationpatentst hatmaycoversuchprocessesorcompositions.

5 Werecommendthateachprospectiveusertesthi sproposedapplicationbeforerepetitiveuse, usingthisdataasa guide. ,alltrademarksinthisdocumentare trademarksof + + +