Manufacturing Capabilities September 2011 - Ttm …

1 Capabilities North American Operations - CommercialSeptember 2011 Units in mils unless otherwise / Technology Standard (S) / Advanced (A) Chippewa Falls Logan Santa Ana Layer count common S 16 - 34 4 - 20 6 - 24 Layer count max A 44+ 44+ 38+Line width - internal oz S width - internal oz A - internal oz S - internal oz A width - external oz S width - external oz A - external oz S - external oz A drill mechanical S drill mechanical A to metal S to metal A ratio (10 mil drill) A 14:1 14:1 14:1 Aspect ratio (12 mil drill) A 18:1 18:1 16:1 BBV mechanical drill S mechanical drill A drilling depth tolerance S +/- 8 +/- 8 +/- 8 Back drilling depth tolerance A +/- 6 +/- 6 +/- 6 Minimum drill laser via S n/a drill laser via A n/a - l layer build up S yes n/a yesHDI - 2 layer build up A yes n/a yesHDI - 3+ layer build up A no n/a yesMicrovia capture pad / hole S 12 / 5 n/a 12 / 6 Microvia capture pad / hole A 10 / 4 n/a 10 / 4 Microvia aspect ratio S.

2 5:1 n/a .5:1 Microvia aspect ratio A 1:1 n/a 1:1 Minimum thickness S 30 15 15 Maximum thickness A 325 400 250 Minimum core thickness S core thickness (BC) A n/a prepreg fill S prepreg fill A Finished copper - External A 1/4 oz. 1/4 oz. 1/4 Finished copper - External A 4 oz 6 oz 3 ozMin copper foil - Internal A 1/4 oz. 1/4 oz. 1/4 copper foil - Internal A 4 oz. 10 oz. 4 : 28 - 150 ohms S +/- 10% +/- 10% +/- 10%Impedance: 50 - 150 ohms A +/- 7% +/- 7% +/- 7%Panel size S 16 x 18 18 x 24 16 x 21 Panel size S 18 x 24 21 x 24 18 x 24 Panel size S 21 x 24 21 x 27 21 x 24 Panel size A 18 x 27 24 x 27 21 x 28 Panel size A 24 x 31 24 x 28 Panel size A 24 x 36 Panel size A 28 x 31 Panel size A 28 x 36 & MaterialsNorth American Operations - Commercial FacilitiesFacility / Finish Chippewa Falls Logan Santa AnaHASL vertical horizontal verticalFused Sn/Pb no yes out source OSP Entek 106A / Glicoat Entek 106A (HT)

3 Glicoat ENIG Atotech Atotech Rohm & Haas Full panel Hard Au yes yes yes Selective Soft Au out source out source out source Tab Au yes yes yes Immersion Ag MacDermid Enthone OMG Silver Guard 950 Combination finishes yes yes yesMaterial / Application Standard FR4 Low Loss Ultra Low Loss Polyimide / Aramid / BT HybridNelco N4000-7 X Isola FR406 X Isola 370 HR X (LF) Nelco N4000-29X X (LF) Panasonic R-1755 X (LF)Isola IS415 X (LF)Hitachi 67G X (LF)Nanya NPG 170TL X (LF)EMC EM-280 X (LF)Isola FR408 XNelco N4000 -13 / -13EP XNelco N4000-13SI XIsola IS620 XGetek ML200 XNelco N4000-13EP X (LF)Isola FR408HR X (LF)Panasonic R-2125 X (LF)Panasonic Megtron 4 X (LF)Rogers Theta X(LF/HF)Rogers 4350 XRogers 4003 XArlon 25N XPanasonic Megtron 6 X (LF)Nelco 7000-2V0 XNelco 7000-2HT XArlon 35N XArlon 55ST XNelco N5000 XIsola G200 XFR4 + Getek XFR4 + Rogers XFR4 + N4000-13 X* Gore Speedboard C is end of life Capabilities North American Operations - Aerospace & DefenseSeptember 2011 Units in mils unless otherwise noted.

4 * Capability limits subject to change depending on spec governance and / or deviation / Technology Standard (S) / Advanced (A) San Diego Santa Ana Santa Clara Stafford Layer count common S 2 - 16 12 - 18 2 - 44 20 - 44 Layer count max A 18+ 36+ 32+ 44+Line width - internal oz S width - internal oz A - internal oz S - internal oz A width - external oz S width - external oz A - external oz S - external oz A drill mechanical S drill mechanical A to metal (rigid) S to metal (flex) S n/a n/a ratio (10 mil drill) A 10:1 14:1 10:1 12:1 Aspect ratio (12 mil drill) A 16:1 18:1 14:1 16:1 BBV mechanical drill S mechanical drill A depth drill tolerance S +/- 3 +/- 5 +/- 8 +/- 8 Control depth drill tolerance A +/- 2 +/- 3 +/- 4 +/- 6 Minimum drill laser via S drill laser via A - l layer build up S n/a yes yes yesHDI - 2 layer build up A n/a yes yes yesHDI - 3+ layer build up A n/a yes yes yesMicrovia capture pad / hole S n/a 12 / 6 12 / 6 12 / 6 Microvia capture pad / hole A n/a 10 / 5 10 / 4 8 / 4 Microvia aspect ratio S n/a.

5 5:1 .5:1 .5:1 Microvia aspect ratio A n/a 1:1 .75:1 .75:1 Minimum thickness A 20 15 20 20 Maximum thickness A 500 250 300 440 Minimum core thickness S 4 2 2 2 Minimum core thickness (BC, Kapton) A n/a 1 1 1 Minimum prepreg fill S prepreg fill A copper foil - External A 1/4 oz. 1/4 oz. 1/4 oz. 1/4 copper foil - External A 3 oz. 4 oz. 4 oz. 10 copper foil - Internal A 1/4 oz. 1/4 oz. 1/4 oz. 3/8 copper foil - internal A 3 oz.

6 4 oz. 4 oz. 6 : 28 - 150 ohms S +/- 10% +/- 10% +/- 10% +/- 10%Impedance: 50 - 150 ohms A +/- 7% +/- 7% +/- 7% +/- 7%Panel size S 9 x 12 16 x 21 12 x 18 12 x 18 Panel size S 9 x 30 18 x 24 18 x 24 18 x 21 Panel size S 12 x 18 21 x 24 21 x 24 18 x 24 Panel size S 16 x 46 24 x 28 21 x 24 Panel size S 18 x 24 21 x 27 Panel size A 24 x 30 21 x 26 24 x 42 Panel size A 30 x 42 Panel size A 24 x 54 Panel size A 24 x & MaterialsNorth American Operations - Aerospace & DefenseFacility / Finish Stafford Santa Clara San Diego Santa AnaHASL Vertical Vertical Outsouce Vertical Fused Sn/Pb Yes Yes Yes No OSP

7 Outsource Outsource Outsouce Glicoat ENIG MacDermid Atotech Atotech Rohm & Haas Full panel Hard Au Yes Yes Yes Yes Selective Soft Au Yes Yes Yes Outsource Ni/Pd/Au Yes No Yes No Tab Au Yes Yes Yes Yes Immersion Ag Outsource Outsource Outsource MacDermid Combination finishes Yes Yes Yes YesMaterial / Application Standard FR4 Low Loss Ultra Low Loss Polyimide / Aramid / BT HybridNelco N4000-6 X Isola FR406 X Polyclad 370 HR X (LF) Isola IS410 X (LF) Isola IS415 X (LF) Nelco N4000-29 X (LF) Panasonic R-1755 X (LF) Hitachi 67G X (HF) EMC EM-280 X (HF) Nanya NPG 170R X (HF) Nelco N4000-13 (-13EP) X Nelco N4000-13SI X Isola IS620 X Getek ML200 X Isola 620LF X (LF) Nelco N4000-13EP X (LF) Isola FR408 X (LF) Panasonic Megtron + X (LF) Rogers 4350 X X Rogers 4003 X X Arlon 25N X X Panasonic Megtron 6 X (LF)

8 Arlon CLTE X Arlon CLTE XT X Rogers 3000 Series X X Rogers 6000 Series X X Gore Speedboard C* X X XRogers 2929 X X XFEP X Nelco 7000-2V0 X X Nelco 7000-2HT X X Arlon 35N X X Arlon 55ST X X Nelco N5000 X X Isola G200 X FR4 + Getek X XFR4 + Rogers X XFR4 + N4000-13 X XRogers + Speedboard C* X XRogers + 2929 X XRogers + FEP XCLTE + Speedboard C* XCLTE + FEP X * Gore Speedboard C is end of life 2011