HYUPJIN’s Spring Finger Contact

1 HYUPJIN s Spring Finger Contact Where Spring Finger Contact used for? Usages : Electronic Device interconnecting RF module with Main Board on Mobile & IT Machine Connecting RF Module to PCB in an effective way Application : All IT machines such as Mobile Phone, Wearable Dev. Main Board on Smart Phone + RF Antenna Antenna & Sub Board + Main Board seperated connected Product Image ( Line up ) Note - Material : Ti - Cu Alloy - Plating : Au Over Ni , Pd -Ni Over Ni _ (Selective Plating) - Thickness : ~ - Rated Voltage : 30V AC/DC - Rated Current.

2 / pin Robust Type Wall Type Conventional Box Type Finger Type Height (mm) ~Y 2011 Y 2012 Y 2013 Y 2014 Y 2015 Year Wireless Charging Prevent Deformation Ni-Barrier 0 Height Robust Type Box Type SIDE Contact Wearable Contact Pogo Type Spring Finger Contact Load-Map Conventional Type Finger Type Y 2016 Array Type Spring Contact rigidity cost saving Conventional Wall Box Prevent from Contact part deformation Diminish SMD error Hook + prevent from bending part cave in Diminish SMD error WALL (Deformation Prevention) Stopper (Bumper) HOOK function (free from lifting) BENDING protection (free from cave-in) Progress of Spring Finger Contact HOOK function (free from cave-in) Robust Type Box Type Needs Less room for SMD Tightened SMD Space Slim Deformation prevention Cost saving Apply Smaller & lighter ( ) Low profile ( Height) Half Box Type Box Type Partial Ni plating (Ni-Barrier) Function of Spring Finger Contact Feature of Box Type Spring Finger Contact Robust Type ( no lifting & no cave in ) + minimized the length ( )

3 Latch applied for not being lifted from Contact part catching Applied latch type stopper to prevent from rear u-bending deformation Line up Conventional Type H(mm)L(mm)W(mm)Working Range (mm) NoBox Type H(mm)L(mm)W(mm)Working Range (mm) NoLine up Wall Type H(mm)L(mm)W(mm)Working Range (mm) NoLine-up Robust Type H(mm)L(mm)W(mm)Working Range (mm) NoImageLine up (by heights)