Transcription of Calcined Aluminium Oxide Powder - sun-way.com.tw
1 Consumables Data SheetCalcined Aluminium Oxide PowderProduct Data1 micron size:3 micron size:9 micron size:12 micron size:15 micron size:20 micron size:30 micron size:0 CON-0070 CON-0080 CON-0090 CON-0100 CON-0110 CON-0120 CON-013 Introduction:Logitech Calcined Aluminium Oxide Powders are produced usinga unique process which grades the particles in size and shapemore closely than is possible by normal means. The particlesproduced by the process are flat and tend to lie parallel with thesurface being worked; the working pressure is thus more evenlyspread. Breakdown of the abrasive is reduced and abrasiveness is retained for a longer period.
2 The close gradingof Logitech Calcined Aluminium Oxide Powders provides theoptimum combination of cutting rate and surface following advantages can be obtained using LogitechCalcined Aluminium Oxide Powders:Faster Lapping & Polishing- Experience has shown that thesepowders can usually reduce lapping and polishing times by atleast 20% and are particularly effective on hard materials, , silicon and hardened steel (other abrasives have atendency to be crushed and break down too quickly). In someinstances 50% reductions in time have been achieved overconventional powders because a larger particle size may beused without loss of surface in Concentration of Abrasive Slurry - Normally theconcentration of abrasive in a slurry may be reduced by at least25% when changing to Logitech Calcined Aluminium OxideAbrasive Powder from regular alumina Pressure and Plate Speed can be increased - Pressureand plate speed used for lapping can, in most cases, beincreased by up to 10% after changing to Logitech, CalcinedAluminium Oxide Abrasive Powder from regular aluminaabrasives.
3 Thus reducing lapping take full advantage of Logitech Calcined Aluminium OxidePowder, reference should be made to the particle distributioncurves overleaf, thus enabling a Powder which has a larger aver-age particle size than the abrasive currently in use to be example, if a 500 grit (12 micron mean) regular aluminiumoxide Powder is currently used, then it should be replaced with20 micron Logitech Calcined Aluminium Oxide Powder . In eachof the instances noted, surface finish will be relativelyunchanged, due to the lower apparent particle size of theCalcined Aluminium Oxide , resulting from their flatter shapewhen compared to conventional regular Aluminium Oxide abra-sive properties:Hardness, MohProduct typeColourShapeSpecific g/ccAluminium Oxide PowderooLogitech LimitedErskine Ferry Road, Old Kilpatrick, Glasgow G60 5EU, Scotland, : +44 (0) 1389 875444 Fax: +44 (0) 1389 890956e-mail: by:Certificate 12025 Typical Chemical Analysis (3 micron) < on products:Ethane DiolOrdering Data.
4 0 CON-0083 micronCodeMicron size0 CON-0071 micron0 CON-0099 micron0 CON-01012 micron0 CON-01115 micron5 kg5 kg5 kg5 kg5 kgConsumables Data SheetCalcined Aluminium Oxide PowderPack size0 CON-0130 CON-01230 micron20 micron5 kg5 kgApplication detailsSuitable for high precision optical component polishing, & as the final polishing stage for certain types ofthin rock most commonly used particle size. Suitable for a wide range of fine lapping applications with semi-conductor and optical for rapid stock removal on delicate semiconductor materials, such as GaAs and include initial lapping of piezo-electric crystals prior to final lapping with 3 and 1 for initial lapping of precision optical components and for final polishing of hard include backlapping of silicon wafers and fine lapping of quartz and sapphire for coarser lapping of components such as mechanical seals, or with semiconductor and opticalmaterials where high stock removal rates are 506070800size.
5 Micro nsperce nt cumul ati ve204060801003591215 2025303540 Particle Size Distribution Curves.