Material for high frequency signal transmission of substrates
Found 7 free book(s)Low Df Build-up Material for High Frequency Signal ...
www.ectc.net5/30/2013 1 Low Df Build-up Material for High Frequency Signal Transmission of Substrates The 63rd Electronic Components and Technology Conference (ECTC)
Low Warpage Coreless Substrate for IC Packages
www.jiep.or.jp56 Transactions of The Japan Institute of Electronics Packaging Vol. 5, No. 1, 2012 less substrates include no core layers with high rigidity, thermal warpage of coreless substrates becomes larger
FPC Technical Guide - 山下マテリアル株式会社
www.yamashita-net.co.jpFPC Technical Guide 1. FPC quick delivery course 2. YFC Cable(Yamashita Flexible Circuit Cable) 3. Low-loss FPC(GHz band) 4. LCP-FPC suitable for high-speed transmission
- Advanced Organic Technology for 2.5D Interposer
www.ectc.netIEEE 64th ECTC – Orlando, FL, USA Mitsuya Ishida May 27 – 30, 2014 2 • Benefits of 2.5D APX Interposer • Technology Feature of APX • Cross Section • Design Rule Comparison • Material Property • Design Rule for Impedance Control
Developments in Glass Yarns and Fabric Constructions - Isola
www.isola-group.com78 The PCB Magazine • March 2014 F eature by Alun Morgan isola group europe Developments in Glass Yarns and Fabric Constructions Glass fibres are nothing new; the ancient Egyptians reportedly drew coarse fibres from
Xilinx UG393 Spartan-6 FPGA PCB Design Guide
www.xilinx.comSpartan-6 FPGA PCB Design and Pin Planning www.xilinx.com UG393 (v1.3) October 17, 2012 Xilinx is disclosing this user guide, manual, release note, and/ or specification (the "Documentation") to you solely for use in the development
PE42525 and PE426525 Performance Optimization
www.psemi.comApplication Note 66 PE42525/PE426525 Optimization DOC-81384-2 – (08/2017) Page 3 www.psemi.com Alumina Substrate Figure 2 and Figure 3 show two recommended metalization patterns and via placements for alumina substrate carriers on which the PE42525 and PE426525 are assembled.
Similar queries
Material for High Frequency Signal, Material for High Frequency Signal Transmission of Substrates, Low Warpage Coreless Substrate, Substrates, High, FPC Technical Guide, For high, Transmission, Advanced Organic Technology for 2.5D Interposer, Material, Developments in Glass Yarns and Fabric Constructions, Xilinx UG393 Spartan-6 FPGA PCB Design, Spartan-6 FPGA PCB Design, Xilinx