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Section 1 Solder Reflow Basics
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Base Materials for High Speed, High Frequency PC Boards ...
www.qsl.net- Must attempt to permit Proper Solder Reflow. • Ground: All Designs, 2 Layer or Multilayer – - Unused Areas of Every Layer to be Poured with Ground Copper. - Ground Copper and All Ground Planes through Board to be Connected with Vias Every 1/20th - Wavelength Apart (Where Possible). - Vias Closer than 1/20th λ are Better.