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The Di Erence Between Proportions
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Silicon Wafer Production and Specifications - MicroChemicals
www.microchemicals.comdiff erence d 1 - d 2 (Fig. 22 top) between the minimum and maximum thickness of a wa-fer. Up to a diameter of 4 inches, wafers are usually specifi ed on TTV <10 μm (TTV <5 μm can be realised without great technical eff ort). For larger diameters, the attainable values for TTV also increase. Bow The bow is defi ned by d 3 + d 4 (Fig. 22 ...