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Search results with tag "Zynq 7000 soc packaging and pinout"

Zynq-7000 SoC (Z-7030, Z-7035, Z-7045, and Z-7100): DC …

Zynq-7000 SoC (Z-7030, Z-7035, Z-7045, and Z-7100): DC …

www.xilinx.com

For soldering guidelines and thermal considerations, see the Zynq-7000 SoC Packaging and Pinout Specification (UG865). Table 1: Absolute Maximum Ratings (1) (Cont’d) Symbol Description Min Max Units Send Feedback. Zynq-7000 SoC (Z-7030, Z-7035, Z-7045, and Z-7100): DC and AC Switching Characteristics

  Packaging, 7000, Zynq, Pinout, 7000 soc, Zynq 7000 soc packaging and pinout

Zynq-7000 SoC Packaging and Pinout Product Specification

Zynq-7000 SoC Packaging and Pinout Product Specification

www.xilinx.com

The FFG, FBG, SBG, and RFG flip-chip packages are RoHS 6 of 6 compliant, with exemption 15 where there is lead in the C4 bumps that are used to complete a viable electrical connection between the semiconductor die and the package substrate.

  Packaging, Packages, 7000, Zynq, Flip, Chip, Pinout, Package chip, Zynq 7000 soc packaging and pinout

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