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Search results with tag "Lead free solder bump technologies for flip chip packaging"
Lead-Free Solder Bump Technologies for Flip-Chip …
www.ait.com.hkLead-Free Solder Bump Technologies for Flip-Chip Packaging Applications Zaheed S. Karim1 and Jim Martin2 1Advanced Interconnect Technology Ltd. 1901 Sunley Centre, 9 …