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Search results with tag "Bonding to the chip face"

Bonding to the Chip Face - Engineering Training Courses

Bonding to the Chip Face - Engineering Training Courses

www.idc-online.com

Bonding to the Chip Face ‘Wire bonding’ is used throughout the microelectronics industry for interconnecting dice, substrates and output pins.

  Engineering, Faces, Bonding, Chip, Bonding to the chip face

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