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19th IEEE/ACIS International Conference on Software ...

CALL FOR PAPERS 19th IEEE/ACIS International Conference on Software engineering , artificial intelligence , networking and Parallel/Distributed Computing ( IEEE/ACIS SNPD 2018) June 27-29, 2018 Busan, Korea Sponsored by IEEE and ACIS, USA Venue: The Novotel Ambassador Hotel on Heundae Beach in Busan, Korea The 19th IEEE/ACIS International Conference on Software engineering , artificial intelligence , networking and Parallel/Distributed Computing ( IEEE/ACIS SNPD 2018) brings together researchers, scientists, engineers, industry practitioners, and students to discuss, encourage and exchange new ideas, research results, and experiences on all aspects of computer and information science.

CALL FOR PAPERS 19th IEEE/ACIS International Conference on Software Engineering, Artificial Intelligence, Networking and Parallel/Distributed Computing

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Transcription of 19th IEEE/ACIS International Conference on Software ...

1 CALL FOR PAPERS 19th IEEE/ACIS International Conference on Software engineering , artificial intelligence , networking and Parallel/Distributed Computing ( IEEE/ACIS SNPD 2018) June 27-29, 2018 Busan, Korea Sponsored by IEEE and ACIS, USA Venue: The Novotel Ambassador Hotel on Heundae Beach in Busan, Korea The 19th IEEE/ACIS International Conference on Software engineering , artificial intelligence , networking and Parallel/Distributed Computing ( IEEE/ACIS SNPD 2018) brings together researchers, scientists, engineers, industry practitioners, and students to discuss, encourage and exchange new ideas, research results, and experiences on all aspects of computer and information science.

2 SNPD 2018 aims to facilitate cross-fertilizations among the key technology enabling areas and is soliciting papers in these areas. The topics of interests include, but are not limited to, the following: Algorithms Data Mining and Machine Learning Operating Systems artificial intelligence Database System Management Parallel and Distributed Computing Audio and Video Technology E-Commerce and its applications Software Specification & Architecture Case-Based Reasoning Embedded Systems Software Testing Collaborative Computing Image, Speech, and Signal Processing Visual and Multimedia Computing Communication Systems and Networks Information Assurance Voice-over-IP and Security Component-Based Software engineering Internet Technology and Applications User-Centered Design Methods Cryptography and Network Security Mobile/Wireless/Ad-Hoc Networks Web-Based Applications Natural Language Processing Neural Networks & Genetic Algorithms IEEE/ACIS SNPD 2018 Proceedings will be published by IEEE Conference Publishing Services and will be submitted to be indexed by EI, INSPEC.

3 And DBLP Conference officers will select outstanding papers for publication in the following journals ( ): International Journal of Networked and Distributed Computing (IJNDC), Paris, France International Journal of Software Innovation (IJSI), IGI Globe, Studies in Computational intelligence (SCI), Springer, Germany Conference officers are arranging two special issues of SCI-Indexed Journals to publish outstanding papers. Special Issue: Machine Learning for Intelligent Systems Journal of Robotics, networking and artificial Life (JRNAL) Special Issue: Knowledge-Based Intelligent Systems for Smart Computing International Journal of Computational intelligence Systems (IJCIS) Best Paper Award and Best Student Paper Awards will be conferred at the Conference (in order to qualify for the award, the paper must be presented at the Conference .)

4 Organizing Committee General Chair: Roger Lee, Central Michigan University, USA. Conference Co-Chair: Haeng-Kon Kim, Catholic University of DaeGu, Korea. Huaikou Miao, Shanghai University, China Takayuki Ito, Nagoya Institute of Technology, Japan Program Co-Chairs: Hyun Yeo, SunChon National University, Korea. Chung Sun Hong, Kyung Hee University, Korea. Gun Huck Yeom, Pusan National University, Korea. Lizhi Cai, Shanghai Key Laboratory of Computer Software Evaluating & Testing, China. Tokuro Matsuo, Advanced Institute of Industrial Technology, Fukuta, Shizuoka University, Jin Hwang, Sunway University, Malaysia Registration Co-Chair: Byung Ki Kim, Silla University, Korea.

5 Cheong Ghil Kim, Namseoul University, Korea. Shun Shiramatsu, Nagoya Institute of Technology, Japan. Advisory & Social Event Chair: Man-Gon Park, Pu Kyung National University, Korea. Young Jik Kwon, Daegu University, Korea. Local Arrangements Chair: Chang-Su Kim, Pu Kyung National University, Korea. Jun Hyun Lee, DongMyung University, Korea. Young Tak Kim, Young Nam University, Korea. Chilwoo Lee, Chonnam National University, Korea. Publicity Co-Chairs: Oh Hyun Kwon, DongMyung University, Korea. Sun-Myung Hwang, DaeJeon University, Otsuka, Nagoya Institute of Technology, Japan. Finance Chair: Jeong Ah Kim, Catholic Kwan Dong University, Korea.

6 Publication Chair: Roger Lee, Central Michigan University, USA. Important Dates Workshop/Special session proposal: February 14, 2018 Workshop/Special session acceptance notification: February 28, 2018 Full/Poster Paper submission: April 4, 2018 Acceptance notification: April 18, 2018 Registration & camera-ready papers: May 2, 2018 Conference Dates: June 27-29, 2018


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