2022 DOE SSL Manufacturing Status & Opportunities

1 2022 DOE SSL Manufacturing Status & Opportunities February 2022 ii [This page has intentionally been left blank.] iii Disclaimer This report was prepared as an account of work sponsored by an agency of the United States Government. Neither the United States Government, nor any agency thereof, nor any of their employees, nor any of their contractors, subcontractors, or their employees, makes any warranty, express or implied, or assumes any legal liability or responsibility for the accuracy, completeness, or usefulness of any information, apparatus, product, or process disclosed, or represents that its use would not infringe privately owned rights.

2 Reference herein to any specific commercial product, process, or service by trade name, trademark, manufacturer, or otherwise, does not necessarily constitute or imply its endorsement, recommendation, or favoring by the United States Government or any agency, contractor, or subcontractor thereof. The views and opinions of authors expressed herein do not necessarily state or reflect those of the United States Government or any agency thereof. iv Comments The Department of Energy is interested in feedback or comments on the materials presented in this document. Please write to Brian Walker, DOE BTO Solid-State Lighting Program Manager: Brian Walker Lighting Program Manager Department of Energy 1000 Independence Avenue SW Washington, DC 20585-0121 Authors This report was prepared for: Solid-State Lighting Program Building Technologies Office Energy Efficiency and Renewable Energy Department of Energy This publication may be reproduced in whole or in part for educational or non-profit purposes without special permission from the copyright holder, provided acknowledgement of the source is made.

3 The document should be referenced as: DOE BTO Solid-State Lighting Program, 2020 DOE SSL Manufacturing Status & Opportunities Lead Author: Monica Hansen, LED Lighting Advisors Contributors: Norman Bardsley, Bardsley Consulting Morgan Pattison, Solid State Lighting Services, Inc. Kyung Lee, Guidehouse, Inc. v Acknowledgments The authors would like to acknowledge the valuable contribution provided during the preparation of this report. Dr. Brian J. Walker of the Department of Energy, Building Technologies Office offered oversight of this assignment, helping shape the approach, execution, and documentation. The author would like to thank James Murphy of GE Research for technical discussions on phosphor Manufacturing .

4 Vi List of Acronyms Abbreviation Definition $/klm dollar per kilolumen of light $/m2 dollars per square meter 3D three-dimensional Al O alumina ALD atomic layer deposition AlGaInP aluminum gallium indium phosphide AlN aluminum nitride ANSI American National Standards Institute AuSn gold-tin AVI automatic visual inspection BOM bill of materials C6H3 phenyl CAD computer-aided design Cd cadmium cd/m2 candelas per square meter CdSe cadmium selenide CES Consumer Electronics Show CGL charge generation layers CH3 methyl CIE Commission international de l' clairage CMOS complementary metal-oxide semiconductor CO2 carbon dioxide COB chip-on-board COC cyclo-olefin copolymers COO cost of ownership Cp2Mg bis-(cyclopentadienyl)

5 -magnesium Cpk process capability DALI Digital Addressable Lighting Interface DFM design for Manufacturing DLC DesignLights Consortium DOE Department of Energy DPSS diode pumped solid state DRAM distributed recycling and additive Manufacturing DUT device under test EBL electron blocking layer EIL electron injection layer EMC epoxy molding compound EML emissive layers EOL end of life vii EQE external quantum efficiency ETL electron transport layer EU European Union FPD flat panel display Fraunhofer FEP Fraunhofer Institute for organic Electronics, Electron Beam and Plasma Technology Fraunhofer IWS Fraunhofer Institute for Material and Beam Technology FWHM full width at half maximum GaAs gallium arsenide GaN gallium nitride H2 hydrogen H2O water H2S hydrogen sulfide HBL hole blocking layer HDPE high density polyethylene HIL hole injection layer HTL hole transport layer HVPE hydride vapor phase epitaxy HVPE hydride vapor-phase epitaxy IES Illuminating Engineering Society IJP ink-jet printing InGaN indium gallium nitride InP indium phosphide IQE internal quantum efficiency IR infrared ITO indium tin oxide K Kelvin LED light emitting diodes LES light - emitting surface LLO laser liftoff

6 Lm/W lumens per watt Lp rated flux maintenance life m2 square meters MBE molecular beam epitaxy MCC Mitsubishi Chemical Corp MC-PCB metal-core printed circuit board MES Manufacturing execution systems MLS Mulinsen mm millimeter mm2 square millimeters Mm2 million square meters Mn manganese MOCVD metal organic chemical vapor deposition viii MQW multi-quantum well n-doped n-type doped semiconductor N2 nitrogen NGS Next Generation Source NH3 ammonia nm nanometer NPB N,N -Di(1-naphthyl)-N,N -diphenyl-(1,1 -biphenyl)-4,4 -diamine O2 oxygen OLED organic light emitting diodes OVJP organic vapor jet printing OVPD organic vapor phase deposition p-doped p-type doped semiconductor PC polycarbonate PCB printed circuit board PC-LED phosphor converted light emitting diode PCT Polycyclohexylene-dimethylene Terephthalates PEC photoelectrochemically PECVD plasma enhanced chemical vapor deposition PET polyethylene terephthalate PF power factor PLCC plastic leaded chip carrier PMMA polymethylmethacrylate PPA polyphthalamide ppb parts per billion ppm parts per million PSS Patterned Sapphire Substrates PVD physical vapor deposition QCM quartz crystal microbalances QD

7 Quantum dot QDEL quantum dot electroluminescence QFN quad flat no-lead R&D research and development R2R roll-to-roll RGBA red, green, blue, amber RoHS Restriction of Hazardous Substances SAC tin silver copper SDS sorted die sheets SEI Sumitomo Electric Industries Si silicon SiC silicon carbide SiH4 silane SKU stock keeping unit SMC silicone molding compound ix SMT surface mount technology SPC statistical process control SSL solid-state lighting TADF thermally activated delayed fluorescence TEC thermal expansion coefficient TFFC thin film flip chip TiO2 titanium oxide TIR total internal reflection TMAl trimethylaluminum TMG trimethylgallium TMIn trimethylindium UL Underwriters Laboratories Inc.

8 USTR United States Trade Representative UTG ultra-thin glass UV ultraviolet VCSELs vertical cavity surface emitting lasers VOC volatile organic compound VTE vaccuum thermal evaporation W/mK watts per meter Kelvin YAG yttrium aluminium garnet YAG:Ce3+ cerium-doped yttrium aluminum garnet ZrO2 zirconium oxide m micron (micrometer) m/hr micrometers per hour cm ohm centimeters / ohms per square x Executive Summary Solid state lighting (SSL) has grown to be a prominent lighting technology with its continually rising efficacy and long lifetimes, as well as its unique features that can enable new functionality and form factors. The maturation of light emitting diodes (LEDs), organic light emitting diodes (OLEDs), and SSL-based luminaire products over the past decade has led to an evolution of Manufacturing approaches and a shift of the overall lighting supply chain makeup.

9 The Manufacturing processes for LEDs and LED-based lighting products have quickly moved into large-scale production processes with ever increasing performance and decreasing prices. The relative breakdown of subsystem costs has shifted significantly during this period, as LED packages were once the highest cost in the lighting system and are now among the lowest-cost subsystem. Despite the success to date, the changing features, requirements, and expectations for LED lighting products requires continued efforts to reduce Manufacturing costs, accelerate adoption, and ensure products meet the levels of quality and reliability necessary for general illumination.

10 With the ongoing innovation of SSL technology, there is still an opportunity to rethink how products and components are manufactured across the product value chain and to embed sustainable Manufacturing processes and materials into the Manufacturing supply chain. For continued progress, Manufacturing processes and technologies must adjust to further improve lighting product quality, reduce cost, and enable a wider variety of form factors and features as the technologies evolve. The unique technology features available with SSL present the opportunity to establish new Manufacturing approaches and foster domestic Manufacturing for portions of the supply chain.