3600Plus PowerRibbon Large Wire Bonder Specifications ...

1 SpecificationsAuthorized Orthodyne Representative:16700 Redhill Ave., Irvine CA 92606 phone 949-660-0440 / fax 36-305 All rights reserved. Copyright 2006. Orthodyne Electronics subject to change without Bond Area .. 150 mm (Y) x 250 mm (X)Optional 300 mm x 300 mm worktableZ - Axis .. 50 mm Z-stroke, m resolution - Axis .. 220 , resolutionProgrammable Focus .. 30 mm range, mm resolutionPower Requirements .. 180 - 240 VAC, single phase, 50/60 Hz,line conditioner included Power Consumption .. 5A at 230 VMicroscope ..Stereo zoom with adjustable work distanceMonitor .. 17-inch Color Flat PanelWork Height.

2 1000 mm from floor (nominal),adjustable (934 - 1050 mm), meetsSMEMA requirement (940 - 965 mm)Foot Print .. 680 mm wide x 1308 mm deepSafety Standards .. CE certification through TUV Large Wire BondheadType .. Orthodyne Rotary, front or back cut with active clamps, optional front or back cut version w/o clampTransducer .. Orthodyne, 60 kHz, 80 kHz frequency upon requestBond Force .. Programmable 50 g - 1500 g Bondhead Pull Test .. Available for ALC style bondhead Large PowerRibbon BondheadType .. Orthodyne RotaryTransducer .. Orthodyne, 80 kHzRibbon Sizes .. 30 x 3 mil to 80 x 8 mil. Others may be available by requestWire Handling Large WireWire Range.

3 100 m to 500 m diameter, <125 m front cut only recommendedWire Feed .. Motorized wire dereeler with opticalencoder Missing Wire Detection .. Wire deformation monitoringMax. Wire Looping .. mmMinimum Wire Length Detection .. mm wire feedWire Spool Size .. 50 - 120 mm OD, 22 - 45 mm width,10 - 11 mm IDPattern Recognition/Optics Vision System .. Enhanced Orthodyne GSIII PatternRecognition SystemDigital Zoom Available .. YesDie Rotation .. 7 degrees from nominal for point anddual point mode, 20 degrees fromnominal for edge modeSystem ConfigurationCPU .. VME PowerPC, for RTS (Real Time Server)CPCI Pentium, for DM (Data Manager)File Storage.

4 Hard disk, CDRWComm. Ports .. Serial port, Ethernet, USB, SECS/GEM interface (optional)Discrete I/O Lines .. Standard: 32 lines. Expanded I/O (upto 64 lines) optional. Two 32- line ports available on front panelOperating System .. VxWorks for Real Time Function Windows XP for Graphical User InterfaceNumber of Bonds/Program ..5000 bondsMade the Orthodyne WayThe new 3600 Plus represents a new wire Bonder plat-form that meets today s advanced packaging technology delivers high productivity, process sta-bility, low cost of ownership (COO) and the flexibilityto grow with market design of this new product family is based ondecades of experience.

5 Since 1962 Orthodyne has devel-opedand perfected its core competencies in MotionTechnology, Pattern Recognition and complete solutions with award-winning sup-port, investing long-term to excel in an ever-changingindustry and pairing leading-edge technology withcustomer dedication is the Orthodyne way. Orthodyne 3600 PlusLarge Wire BonderVersatility PlusCombining innovation and experience with the proven 3600 platform, Orthodyne has introduced,not only the fastest, most productive Large wirebonder, but also the first wire Bonder config-urable to PowerRibbon on the market the new3600 Plus. The 3600 Plus establishes the latest inmotion control technology, software, testing, andmonitoring capabilities for power modules, auto-motivepackages and other MCM bring you unprecedented process monitoring, Orthodyne linked non-destructive pulltestingtechnology (ALC) and the optional Bond ProcessMonitoring (BPM)

6 System, now available for front-and rear 3600 Plus features the latest digital ultrasonicgenerator technology and the largest variety ofbondhead configurations for Large wire to handlevirtually any package the newest Orthodyne GSIII PR system or theoptional Cognex PatMax , the 3600 Plus providesthe most versatile pattern recognition systemavailable. The Large 300mm x 300mm work tableor the Offline Programming Tool (OPT) offeradditional pluses built into the 3600 Plus are made possiblethrough Orthodyne s experience and understandingof changing customer needs. With a commitmentto outstanding performance, exceptional customerservice and ongoing product development, we vemade a better Bonder even ISO 9001 andISO 14001 CompanyLarge Wire BonderPowerRibbon Bonder3600 PlusSpeedLow-mass bondheadand unique XY tabledesign combined withhigh performancelinear motors andadvanced motioncontrol technologyresult in the mostproductive Large wirebonders on the Low-MaintenanceBondheadLow maintenancebondhead features amodular design thatis easy to set-up andmaintain resulting inhigher PREnhanced third gen-eration system (GSIII)

7 Offers accuracy andrepeatability througha variety of powerfultools for virtuallyevery device. OptionalCognex PR Systemincluding PatMax Continuous feedbackof major equipmentfunctions results in higher uptime and controlled OptionsBond Process Monitoring Option (BPM)detects process variations real-time. Process feedbackcan be stored locally or shared with a host Cut Bondhead provides added clearance and allows cutting on a sensitive surface ( , die).Extra Deep Access Bondhead Kits accommodate deeper package Status Light Towerfeatures three programmable lights as well as an audio Casters facilitate the relocation of the 3600 Plus.

8 Large Moving Work Table expands the work area to 300 mm x 300 mm. Offline Programming Tool (OPT) lets youconvert existing CAD files into machine process programs, significantly increasing machine Lighting Optionsoffer solutions for every possible Protocols are supported for various factory automation Option converts your Large wire system into a PowerRibbon Bonder , capable of processingAl Ribbon in sizes 30 x 3 mil to 80 x 8 mil. Cognex PR System including PatMax expandable cutting edge capabilitiescost of ownershipuncompromised qualityUnprecedented Productivity Per Bond Parameters 3600 Plus Softwaremakes virtually everybond parameter pro-grammable on a per bond level.

9 Thiscustomization assuresmaximum flexibilityand bond quality foreven the mostadvanced ControlThe 3600 Plus bond-head featuresOrthodyne s third-generation pro-grammable improved accu-racy andlinearitythroughout thebondforce rangeensures a consistentbond process. Multiple BondFrequenciesMultiple bond fre-quency options areavailable. All bond frequencies are supported throughOE proprietary digitalgenerator New GUI-basedsoftware structureoffers simplifiedand user-friendlymachine operationand sophisticatedtrouble shootingtools resulting inlower training costand increased LoopControlBondheads(ALC)Available as Front or Rear Cut version,the bondhead designprovides excellentloop control andnon-destructive pull-test ProcessMonitoring Optional systemmonitors bonddeformation andultrasonic signal inreal-time.

10 Suspectbonds are flaggedand vital processinformation can bestored for Networkingvia is avail-able as an HandlingCDRW, hard drive,USB and networkingprovide easy-to-usetools for data transfer,data storage, andprogram MachineDesign &SystemArchitecture Completely opentable design allowsopen access frombelow the work shuttleand clamping systemsas well as line integra-tionare simple tablecan be completelyremoved or replacedto make room forany customizedclamping scheme. Large WorkArea250mm (X) x 150mm(Y) x 50mm (Z) pro-vides access for largeand deep packagesand space for con-venient manual orautomatic loading of parts. A 300 mm(X) x 300mm (Y) Large table option is availablewithfront and backcut bondheads.