A standard developed by IPC

1 IPC-6012C-TC2013 - JulyTest Coupon Addendum toIPC-6012C Qualification andPerformance Specification forRigid Printed BoardsA standard developed by IPC Association Connecting Electronics IndustriesThe Principles ofStandardizationIn May 1995 the IPC s Technical Activities Executive Committee (TAEC) adopted Principles ofStandardization as a guiding principle of IPC s standardization : Show relationship to Design for Manufacturability(DFM) and Design for the Environment (DFE) Minimize time to market Contain simple (simplified) language Just include spec information Focus on end product performance Include a feedback system on use andproblems for future improvementStandardsShouldNot: Inhibit innovation Increase time-to-market Keep people out Increase cycle time Tell you how to make something Contain anything that cannotbe defended with dataNoticeIPC standards and Publications are designed to serve the public interest through eliminating mis-understandings between manufacturers and purchasers, facilitating interchangeability and improve-ment of products, and assisting the purchaser in selecting and obtaining with minimum delay theproper product for his particular need.

2 Existence of such standards and Publications shall not inany respect preclude any member or nonmember of IPC from manufacturing or selling productsnot conforming to such standards and Publication, nor shall the existence of such standards andPublications preclude their voluntary use by those other than IPC members, whether the standardis to be used either domestically or standards and Publications are adopted by IPC without regard to whether their adop-tion may involve patents on articles, materials, or processes. By such action, IPC does not assumeany liability to any patent owner, nor do they assume any obligation whatever to parties adoptingthe Recommended standard or Publication. Users are also wholly responsible for protecting them-selves against all claims of liabilities for patent PositionStatement onSpecificationRevision ChangeIt is the position of IPC s Technical Activities Executive Committee that the use and implementationof IPC publications is voluntary and is part of a relationship entered into by customer and an IPC publication is updated and a new revision is published, it is the opinion of the TAEC that the use of the new revision as part of an existing relationship is not automatic unless requiredby the contract.

3 The TAEC recommends the use of the latest October 6, 1998 Why is therea charge forthis document?Your purchase of this document contributes to the ongoing development of new and updated industrystandards and publications. standards allow manufacturers, customers, and suppliers to understandone another better. standards allow manufacturers greater efficiencies when they can set up theirprocesses to meet industry standards , allowing them to offer their customers lower spends hundreds of thousands of dollars annually to support IPC s volunteers in the standardsand publications development process. There are many rounds of drafts sent out for review andthe committees spend hundreds of hours in review and development. IPC s staff attends and par-ticipates in committee activities, typesets and circulates document drafts, and follows all necessaryprocedures to qualify for ANSI s membership dues have been kept low to allow as many companies as possible to , the standards and publications revenue is necessary to complement dues revenue.

4 Theprice schedule offers a 50% discount to IPC members. If your company buys IPC standards andpublications, why not take advantage of this and the many other benefits of IPC membership aswell? For more information on membership in IPC, please visit or call 847 you for your continued support. Copyright 2013. IPC, Bannockburn, Illinois, USA. All rights reserved under both international and Pan-American copyright , scanning or other reproduction of these materials without the prior written consent of the copyright holder is strictly prohibited andconstitutes infringement under the Copyright Law of the United Coupon Addendumto IPC-6012C Qualificationand PerformanceSpecification forRigid Printed BoardsDeveloped by the Test Coupon Addendum Task Group (D-33ac) of theRigid Printed Board Committee (D-30) of IPCU sers of this publication are encouraged to participate in thedevelopment of future :IPC3000 Lakeside Drive, Suite 309 SBannockburn, Illinois60015-1249 Tel 847 847 AcknowledgmentAny document involving a complex technology draws material from a vast number of sources.

5 While the principal membersof the Test Coupon Addendum Task Group (D-33ac) of the Rigid Printed Board Committee (D-30) are shown below, it isnot possible to include all of those who assisted in the evolution of this standard . To each of them, the members of the IPCextend their Printed BoardCommitteeTest Coupon AddendumTask GroupTechnical Liaison of theIPC Board of DirectorsChairVicka WhiteHoneywell Inc. Air Transport SystemsVice-ChairDebora ObitzTrace Laboratories - EastChairMark BuechnerBAE SystemsVice-ChairRandy R. ReedViasystems Group, NevesMicrotek LaboratoriesTest Coupon Addendum Task GroupLance A. Auer, Raytheon MissileSystemsSteven A. Bowles, Viasystems Group, Chevalier, Amphenol PrintedCircuits, Don Dupriest, Lockheed MartinMissiles & Fire ControlKatie N. Feistel, The AerospaceCorporationGary M. Ferrari, FTG CircuitsLionel Fullwood, WKK S.

6 Gandhi, NorthropGrumman Aerospace SystemsMichael R. Green, Lockheed MartinSpace Systems CompanyLouis Hart, Compunetics M. Henault, RaytheonCompanyJim Holme, Kimball ElectronicsNick S. Koop, TTM TechnologiesKarin LaBerge, KAL ConsultingJeff Lewis, Holaday Circuits Mahanna, Robisan J. Monarchio, TTMT echnologies, Nargi-Toth, NCAB GroupUSA, M. Nolan, Lockheed MartinMission Systems & TrainingWilliam A. Ortloff, RaytheonCompanyJose A. Rios, Endicott InterconnectTechnologies IncDavid Sommervold, The BergquistCompany, PrescottVicka White, Honeywell Inc. AirTransport SystemsJuly 2013 IPC-6012C-TCiiiTest Coupon Addendum to IPC-6012C Qualification andPerformance Specification for Rigid Printed ScopeThis addendum provides requirements on the utilization of test coupon designs taken from Appendix A of IPC-2221 Revision B for lot acceptance testing and quality conformance PurposeWhen required by procurement documentation/drawings, this Addendum replaces specifically identifiedrequirements of PrecedenceThe contract takes precedence over this Addendum, referenced standards and user-approved the event of a conflict between this Addendum and the applicable documents cited herein, this Addendum takes prece-dence.

7 Where referenced criteria of this addendum differ from the published IPC-6012C, this Addendum takes Existing or Previously Approved DesignsThis Addendumshallnotconstitute the sole cause for the redesign ofpreviously approved designs. When drawings for existing or previously approved designs undergo revision, they should bereviewed and changes made that allow for compliance with the requirements of this Use of this AddendumThis addendumshallnotbe used as a stand-alone criteria are not supplemented by this addendum, the requirements of performance and requirement changes or additions provided within Table 1 of this Addendum are solely compatible withIPC-2221 Appendix A conformance coupons unless otherwise stated within this Addendum. For IPC-2221 Appendix B con-formance coupons, use the IPC-6012C performance and requirements sections.

8 The addition of IPC-2221 Appendix A con-formance coupons by the printed board fabricator to the production panelshallbe clauses modified by this Addendum do not include subordinate clauses unless specifically stated ( , changes made do not affect unless is also addressed in this Addendum.)July 2013 IPC-6012C-TC1 Table 1 IPC-6012C Requirements for IPC-2221B Appendix A Test CouponsIPC-6012 CReferenceRequirement (as changed by this Addendum)2 Append the following to IPC:IPC-TM-650 Test Methods Shorts, Internal on Multilayer Printed DefinitionAppend the following paragraph:The L and S elements of the AB/R coupon provide an indication of the etching characteristics of the layer andthe ability to meet the minimum conductor and space requirements. When specified by the user, the use andacceptance parameters for the L and S elements of the AB/R couponshallbe AABUS.

9 In the event that thedimensional measurements on the AB/R, BR, and AR coupons disagree with the visual assessment or AOIinspection results, the visual assessment or AOI inspection results of the printed boardshalltake IntegrityReplace the 1st sentence of the 2nd paragraph as follows:Although the AB/R, A/R, or B/R coupons are assigned for this test, the allowance for the usage of printed boards toestablish acceptance for the productshallbe the 1st sentence of the 3rd paragraph as follows:The production printed boards and other test coupons in the quality conformance test circuitry which contain PTHsand similar non-functional land designsshallbe capable of meeting the requirements of this the 2nd sentence of the 4th paragraph as follows:The production printed boards or quality conformance test circuitryshallbe tested after exposure to all coating,final finish, and thermal RequirementsMove the last sentence of the 1st paragraph to a new 2nd paragraph as follows:The grinding and polishing accuracy of the microsectionsshallbe such that the viewing area of the PTHs is within10% of the drill hole diameter of the hole.

10 For the B/R coupon, each via structure of the B/R couponshallhave aminimum of three holes within 10% of the drill hole diameter. If all the via structures of the B/R coupon are not intolerance at one time, the suppliershalluse one of the below options to inspect the via structures outside the 10%tolerance. If any of the via structures are non-compliant, option A or B as shown below are not If the via structures within the 10% tolerance on the sample are compliant, do subsequent grinding andpolishing of the original sample to inspect the via structures outside of the 10% tolerance. Prior to subsequentgrinding, objective evidence in the form of measurements and photographsshallbe required for a minimum of3 holes on all via structures that are inside of the 10% tolerance on the sample. Measurementsshalldocumentcompliance to Section Photographs after microetch of the via structureshallbe taken at the Preparing additional sample(s) for evidence in the form of the sample(s) or measurements and photographs after microetchshallberequired for a minimum of 3 holes on all via structures that are inside of the 10% tolerance on the sample(s).