Acceptability of Electronic Assemblies

1 IPC-A-610E-2010 Acceptability of ElectronicAssembliesDeveloped by the IPC-A-610 development team including Task Group(7-31b), Task Group Asia (7-31bCN) and Task Group Nordic (7-31bND)of the Product Assurance Committees (7-30 and 7-30CN) of IPCU sers of this publication are encouraged to participate in thedevelopment of future :IPC3000 Lakeside Drive, Suite 309 SBannockburn, Illinois60015-1249 Tel 847 847 :IPC-A-610D - February 2005 IPC-A-610C - January 2000 IPC-A-610B - December 1994 IPC-A-610A - March 1990 IPC-A-610 - August 1983 1 Definition of Criteria .. Condition .. Condition .. Condition .. Disposition .. Indicator Condition .. Process Indicator Methodologies .. Conditions .. Not Specified .. Designs .. Terms & Orientation.

2 *Primary Side .. *Secondary Side .. Source Side .. Destination Side .. *Cold Solder Connection .. Clearance .. Voltage .. Solder .. *Leaching .. (Component) .. *Nonfunctional Land .. Diameter .. Overwrap .. Overlap .. Examples and Inspection Verification of Magnification 1-62 Applicable IPC Joint Industry EOS/ESD Association Electronics Industries Alliance International Electrotechnical Technical 2-23 Handling Electronic EOS/ESD Overstress (EOS) .. Discharge (ESD) .. Labels .. Materials .. EOS/ESD Safe Handling .. Damage .. Assemblies .. Soldering .. and Finger Cots .. 3-124 Hardware Clearance .. Insulators and Thermal Compounds.

3 Contact .. Fasteners .. Torque .. Wires .. Jackpost 4-11 Table of ContentsviiIPC-A-610E-2010 April Connector Connector Pins .. Fit Pins .. Soldering .. Wire Bundle .. Lacing Damage .. Crossover .. Radius .. Cable .. Wire Termination .. over Splices and Ferrules .. 4-285 Soldering Acceptability Soldering Basis Metal .. Holes/Blow Holes .. of Solder Paste .. Connection .. Solder .. Solder Balls/Solder Fines .. Bridging .. Solder Webbing/Splashes .. Solder .. Solder .. Projections .. Free Fillet Lift .. Free Hot Tear/Shrink Hole .. Marks and Other Similar SurfaceConditions in Solder Joints .. 5-196 Terminal Swaged .. Terminal Base Pad Gap.

4 Terminals Turret .. Terminals Bifurcated .. Flange .. Flange .. Split .. Presolder .. Post-Solder .. Sleeve .. Placement .. Damage .. Damage .. Separation (Birdcaging) Presolder .. Separation (Birdcaging) Post-Solder .. Service Terminals Stress .. Bend .. Terminals Lead/Wire Placement General Terminals Solder General Terminals Turrets and Straight Placement .. Terminals Placement Side RouteAttachments .. Placement Bottom andTop Route Attachments .. Placement Staked Wires .. Terminals Placement .. 6-43 Table of Contents (cont.)viiiIPC-A-610E-2010 April Terminals Placement .. Terminals Placement .. Terminals Solder Placement.

5 Terminals AWG 30 and SmallerDiameter Placement .. Terminals Series Terminals Edge Clip 6-567 Through Hole Component .. Horizontal .. Vertical .. Forming .. Bends .. Stress Relief .. Damage .. Crossing Conductors .. Obstruction .. Devices and Sockets .. Leads Vertical .. Spacers .. Leads Horizontal .. Right Angle .. Vertical Shrouded Pin Headers andVertical Receptacle Connectors .. Power .. Cases .. Component Clips .. Bonding .. Bonding NonelevatedComponents .. Bonding ElevatedComponents .. Hold Down .. Supported Leaded Horizontal .. Leaded Vertical .. Protrusion .. Clinches .. fill (A) .. Side Lead to Barrel (B) .. Side Land Area Coverage (C).

6 Side Lead to Barrel (D) .. Side Land Area Coverage (E) .. Conditions Solder in Lead Bend .. Conditions Touching Through-HoleComponent Body .. Conditions Meniscus in Solder .. Cutting after Soldering .. Coated Wire Insulation in Solder .. Interfacial Connection without Lead Vias .. Board in Board .. Unsupported Leads Horizontal .. Leads Vertical .. Protrusion .. Clinches .. Cutting after Soldering .. Jumper Selection .. Routing .. Staking .. Holes .. in Hole .. Attachment .. Soldered .. 7-73 Table of Contents (cont.)ixIPC-A-610E-2010 April 20108 Surface Mount Staking Bonding .. Strength .. SMT .. SMT Chip Components BottomOnly Overhang (A) .. Overhang (B).

7 Joint Width (C) .. Joint Length (D) .. Fillet Height (E) .. Fillet Height (F) .. Thickness (G) .. Overlap (J) .. Rectangular or Square End ChipComponents 1, 3 or 5 Overhang (A) .. Overhang (B) .. Joint Width (C) .. Joint Length (D) .. Fillet Height (E) .. Fillet Height (F) .. (G) .. Overlap (J) .. Variations .. Mounting on Side (Billboarding) .. Mounting Upside Down .. Stacking .. Tombstoning .. Terminations .. 3 Terminations Solder Width .. 3 Terminations Minimum Fillet Height .. Cylindrical End Cap Overhang (A) .. Overhang (B) .. Joint Width (C) .. Joint Length (D) .. Fillet Height (E) .. Fillet Height (F) .. Thickness (G) .. Overlap (J) .. Castellated Overhang (A).

8 Overhang (B) .. End Joint Width (C) .. Side Joint Length (D) .. Fillet Height (E) .. Fillet Height (F) .. Thickness (G) .. Flat Gull Wing Overhang (A) .. Overhang (B) .. End Joint Width (C) .. Side Joint Length (D) .. Heel Fillet Height (E) .. Heel Fillet Height (F) .. Thickness (G) .. Round or Flattened (Coined)Gull Wing Overhang (A) .. Overhang (B) .. End Joint Width (C) .. Side Joint Length (D) .. Heel Fillet Height (E) .. Heel Fillet Height (F) .. Thickness (G) .. Side Joint Height (Q) .. J Overhang (A) .. Overhang (B) .. Joint Width (C) .. Joint Length (D) .. Fillet Height (E) .. Heel Fillet Height (F) .. Thickness (G) .. 8-76 Table of Contents (cont.)xIPC-A-610E-2010 April Butt/I Side Overhang (A).

9 Toe Overhang (B) .. End Joint Width (C) .. Side Joint Length (D) .. Fillet Height (E) .. Fillet Height (F) .. Thickness (G) .. Flat Lug Tall Profile Components HavingBottom Only Inward Formed L-Shaped Ribbon Surface Mount Area Alignment .. Solder Ball Spacing .. Solder Connections .. Voids .. Underfill/Staking .. Package on Package .. Bottom Termination Components (BTC).. Components with Bottom ThermalPlane Flattened Post Maximum Termination Overhang Square Solder Land .. Maximum Termination Overhang Round Solder Land .. Maximum Fillet Height .. Specialized SMT Surface Mount Jumper Chip and Cylindrical End Cap Components .. Gull Wing .. J Lead.

10 Castellations .. Land .. 8-1049 Component Loss of Chip Resistor Leaded/Leadless Ceramic Chip Transformer Core Connectors, Handles, Extractors, Edge Connector Press Fit Backplane Connector Heat Sink 9-12 Table of Contents (cont.)xiIPC-A-610E-2010 April 201010 Printed Circuit Boards and Gold Surface Contact Laminate and Crazing .. and Delamination .. Texture/Weave Exposure .. and Edge Delamination .. and Twist .. in Cross-Sectional Area .. Pads/Lands .. Damage .. Flexible and Rigid-Flex Printed .. Wicking .. (Including Hand Printing) .. Bar Coding .. Readability .. Adhesion and Damage .. Position .. Radio Frequency Identification(RFID) Tags.