Acceptability of Electronic Assemblies

1 IPC-A-610 DAcceptability of ElectronicAssemblies2nd Proposed Standard for BallotASSOCIATION CONNECTINGELECTRONICS INDUSTRIES 3000 Lakeside Drive, Suite 309S, Bannockburn, IL 60015-1219 Tel. Fax 2004A standard developed by IPCS upersedes A-610 CJanuary 2000 The Principles ofStandardizationIn May 1995 the IPC s Technical Activities Executive Committee adopted Principles ofStandardization as a guiding principle of IPC s standardization Should: Show relationship to Design for Manufacturability(DFM) and Design for the Environment (DFE) Minimize time to market Contain simple (simplified) language Just include spec information Focus on end product performance Include a feedback system on use andproblems for future improvementStandards Should Not.

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6 All rights reserved under both international and Pan-American copyright copying,scanning or other reproduction of these materials without the prior written consent of the copyright holder is strictly prohibited and constitutesinfringement under the Copyright Law of the United forElectronic AssembliesDeveloped by the IPC Task Group (7-31b) of the Product AssuranceSubcommittee (7-30) of IPCU sers of this publication are encouraged to participate in thedevelopment of future :IPC3000 Lakeside Drive, Suite 309 SBannockburn, Illinois60015-1219 Tel 847 847 :IPC-A-610C - January 2000 IPC-A-610B - December 1994 IPC-A-610A - March 1990 IPC-A-610 - August 1983 ASSOCIATION CONNECTINGELECTRONICS INDUSTRIES This Page Intentionally Left BlankTable of Contents 1 Forward 1-1 Scope 1-2 Purpose 1-3 Specialized Designs 1-3 Terms & Definitions 1-3 Classification 1-3 Acceptance Criteria 1-3 Target Condition 1-4 Acceptable Condition 1-4 Defect Condition 1-4

7 Process Indicator Condition 1-4 Combined Conditions 1-4 Conditions Not Specified 1-4 Board Orientation 1-4 *Primary Side 1-4 *Secondary Side 1-5 Solder Source Side 1-5 Solder Destination Side 1-5 Cold Solder Connection 1-5 Electrical Clearance 1-5 High Voltage 1-5 Intrusive Solder 1-5 Leaching 1-5 Meniscus (Component) 1-5 Pin-in-Paste 1-5 Wire Diameter 1-5 Examples and Illustrations 1-5 Inspection Methodology 1-5 Verification of Dimensions 1-6 Magnification Aids and Lighting 1-6 2 Applicable Documents 2-1 IPC Documents 2-1 Joint Industry Documents 2-1 EOS/ESD Association Documents 2-2 Electronics Industries Alliance Documents 2-2 International Electrotechnical Commission Documents 2-2 3 Handling Electronic

8 Assemblies 3-1 EOS/ESD Prevention 3-2 Electrical Overstress (EOS) 3-3 Electrostatic Discharge (ESD) 3-4 Warning Labels 3-5 Protective Materials 3-6 EOS/ESD Safe Workstation/EPA 3-7 Handling Considerations 3-9 Guidelines 3-9 Physical Damage 3-10 Contamination 3-10 Electronic Assemblies 3-10 After Soldering 3-11 Gloves and Finger Cots 3-12 4 Hardware 4-1 Hardware Installation 4-2 Electrical Clearance

9 4-2 Interference 4-3 Threaded Fasteners 4-3 Torque 4-6 Wires 4-7 Connectors, Handles, Extractors, Latches 4-9 Connector Pins 4-10 Edge Connector Pins 4-10 Press Fit Pins 4-12 Soldering 4-16 Backplanes 4-18 Wire Bundle Securing 4-19 General 4-19 Lacing 4-22 Damage 4-23 Routing 4-24 Wire Crossover 4-24 Bend Radius 4-25 Coaxial Cable 4-26 Unused Wire Termination 4-27 Ties over Splices and Ferrules 4-28 Table of Contents 5 Soldering 5-1 Soldering Acceptability

10 Requirements 5-2 +Soldering Anomalies 5-7 Exposed Basis Metal 5-7 Pin Holes/Blow Holes 5-9 Reflow of Solder Paste 5-10 Nonwetting 5-11 Dewetting 5-12 Excess Solder 5-13 Solder Balls/Solder Fines 5-13 Bridging 5-15 Solder Webbing 5-16 Disturbed Solder 5-17 Fractured Solder 5-18 Solder Projections 5-19 Lead Free Fillet Lift 5-20 Hot Tear/Shrink Hole 5-21 6 Terminal Connections 6-1 Edge Clip 6-1 Swaged Hardware 6-3 Rolled Flange 6-4 Flared Flange 6-5 Flared Flange - Controlled Split 6-6 Terminals 6-7 Turret 6-7 Bifurcated 6-8 Flared Flange Hardware Fused in Place 6-9 Wire/Lead Preparation.