Acceptability of Electronic Assemblies - IPC

1 IPC-A-610 FAcceptability of ElectronicAssembliesDeveloped by the IPC-A-610 development team including TaskGroup (7-31B), Task Group Asia (7-31 BCN), Task Group Nordic(7-31 BND), Task Group German Language (7-31 BDE) and TaskGroup India (7-31 BIN) of the Product Assurance Committees(7-30 and 7-30CN) of IPCU sers of this publication are encouraged to participate in thedevelopment of future :IPC3000 Lakeside Drive, Suite 309 SBannockburn, Illinois60015-1249 Tel 847 847 :IPC-A-610E - April 2010 IPC-A-610D - February 2005 IPC-A-610C - January 2000 IPC-A-610B - December 1994 IPC-A-610A - March 1990 IPC-A-610 - August 1983If a conflict occursbetween the Englishlanguage and translatedversions of this document,the English version willtake precedence.

2 1 Personnel Definition of Acceptance Criteria .. Target Condition .. Acceptable Condition .. Defect Condition .. Disposition .. Process Indicator Condition .. Process Indicator Methodologies .. Combined Conditions .. Conditions Not Specified .. Specialized Designs .. Terms and Board Orientation .. *Primary Side .. *Secondary Side .. *Solder Source Side .. *Solder Destination Side .. *Cold Solder Connection .. Electrical Clearance .. FOD (Foreign Object Debris) .. High Voltage .. Intrusive Solder .. Meniscus (Component) .. *Nonfunctional Land .. Pin-in-Paste .. Solder Balls .. Wire Diameter.

3 Wire Overlap .. Wire Overwrap .. Examples and Inspection Verification of Magnification 1-72 Applicable IPC Joint Industry EOS/ESD Association Electronics Industries Alliance International Electrotechnical Technical 2-23 Handling Electronic EOS/ESD Electrical Overstress (EOS) .. Electrostatic Discharge (ESD) .. Warning Labels .. Protective Materials .. EOS/ESD Safe Handling Guidelines .. Physical Damage .. Contamination .. Electronic Assemblies .. After Soldering .. Gloves and Finger Cots .. 3-124 Hardware Electrical Clearance .. Interference .. Component Mounting High Power.

4 Heatsinks .. Insulators and Thermal Compounds .. Contact .. Threaded Fasteners and OtherThreaded Hardware .. Torque .. Wires .. 4-13 Table of ContentsixIPC-A-610 FJuly Jackpost Connector Edge Connector Pins .. Press Fit Pins .. Soldering .. Wire Bundle General .. Lacing .. Damage .. Routing Wires and Wire Wire Crossover .. Bend Radius .. Coaxial Cable .. Unused Wire Termination .. Ties over Splices and Ferrules .. 4-325 Soldering Acceptability Soldering Exposed Basis Metal .. Pin Holes/Blow Holes .. Reflow of Solder Paste .. Nonwetting .. Cold/Rosin Connection .. Dewetting .. Excess Solder.

5 Solder Balls .. Bridging .. Solder Webbing/Splashes .. Disturbed Solder .. Fractured Solder .. Solder Projections .. Lead Free Fillet Lift .. Lead Free Hot Tear/Shrink Hole .. Probe Marks and Other Similar SurfaceConditions in Solder Joints .. 5-196 Terminal Swaged Terminals .. Terminal Base to Land Separation .. Turret .. Bifurcated .. Rolled Flange .. Flared Flange .. Controlled Split .. Solder .. Damage .. Presolder .. Post-Solder .. Clearance .. Flexible Sleeve .. Placement .. Damage .. Deformation .. Damage .. Stranded Wire .. Solid Wire .. Strand Separation (Birdcaging) Presolder.

6 Strand Separation (Birdcaging) Post-Solder .. Tinning .. Service Stress Bundle .. Lead/Wire Bend .. Lead/Wire Placement Solder General Turrets and Straight Lead/Wire Placement .. Turret and Straight Pin Solder .. Lead/Wire Placement Side RouteAttachments .. Lead/Wire Placement Staked Wires .. Lead/Wire Placement Bottom and TopRoute Attachments .. Solder .. Lead/Wire Placement .. Solder .. 6-43 Table of Contents (cont.)xIPC-A-610 FJuly Lead/Wire Placement .. Solder .. Lead/Wire Placement .. Solder .. Solder Lead/Wire Placement .. Solder .. AWG 30 and Smaller Diameter Wires Lead/Wire Series Edge Clip 6-567 Through-Hole Component Orientation.

7 Orientation Horizontal .. Orientation Vertical .. Lead Forming .. Bend Radius .. Space between Seal/Weld and Bend .. Stress Relief .. Damage .. Leads Crossing Conductors .. Hole Obstruction .. DIP/SIP Devices and Sockets .. Radial Leads Vertical .. Spacers .. Radial Leads Horizontal .. Connectors .. Right Angle .. Vertical Shrouded Pin Headers and VerticalReceptacle Connectors .. Conductive Cases .. Component Mounting Clips .. Adhesive Bonding .. Adhesive Bonding NonelevatedComponents .. Adhesive Bonding ElevatedComponents .. Other Devices .. Supported Axial Leaded Horizontal .. Axial Leaded Vertical.

8 Wire/Lead Protrusion .. Wire/Lead Clinches .. Solder .. Vertical Fill (A) .. Solder Destination Side Lead toBarrel (B) .. Solder Destination Side Land AreaCoverage (C) .. Solder Source Side Lead to Barrel (D) .. Solder Source Side Land AreaCoverage (E) .. Solder Conditions Solder in Lead Bend .. Solder Conditions Touching Through-HoleComponent Body .. Solder Conditions Meniscus in Solder .. Lead Cutting after Soldering .. Coated Wire Insulation in Solder .. Interfacial Connection without Lead Vias .. Board in Board .. Unsupported Axial Leads Horizontal .. Axial Leads Vertical .. Wire/Lead Protrusion .. Wire/Lead Clinches.

9 Solder .. Lead Cutting after Soldering .. Jumper Wire Selection .. Wire Routing .. Wire Staking .. Supported Holes .. Supported Holes Lead in Hole .. Wrapped Attachment .. Lap Soldered .. 7-73 Table of Contents (cont.)xiIPC-A-610 FJuly 20148 Surface Mount Staking Bonding .. Strength .. SMT Components .. SMT Chip Components Bottom Side Overhang (A) .. End Overhang (B) .. End Joint Width (C) .. Side Joint Length (D) .. Maximum Fillet Height (E) .. Minimum Fillet Height (F) .. Solder Thickness (G) .. End Overlap (J) .. Rectangular or Square End ChipComponents 1, 3 or 5 Side Overhang (A).

10 End Overhang (B) .. End Joint Width (C) .. Side Joint Length (D) .. Maximum Fillet Height (E) .. Minimum Fillet Height (F) .. Solder Thickness (G) .. End Overlap (J) .. Termination Variations .. Mounting on Side (Billboarding) .. Mounting Upside Down .. Stacking .. Tombstoning .. Center Terminations .. Solder Width of Side Termination .. Minimum Fillet Height of Side Termination .. Cylindrical End Cap Side Overhang (A) .. End Overhang (B) .. End Joint Width (C) .. Side Joint Length (D) .. Maximum Fillet Height (E) .. Minimum Fillet Height (F) .. Solder Thickness (G) .. End Overlap (J) .. Castellated Side Overhang (A).