Transcription of Acceptability Standard for Manufacture, …
1 IPC-A-630 Acceptability Standard forManufacture, Inspectionand Testing of ElectronicEnclosuresDeveloped by the Requirements for Structural Enclosure Task Group(7-31j) of the Product Assurance Committee (7-30) of IPCU sers of this publication are encouraged to participate in thedevelopment of future :IPC3000 Lakeside Drive, Suite 309 SBannockburn, Illinois60015-1249 Tel 847 847 Table of Contents1 .. Units and Applications .. of Requirements .. or Specialized Designs .. and Definitions .. Backplanes .. Brazing .. Electrical Bonding .. Fiber Optic Cables .. inspection .. Installation Torque .. Manufacturer (Assembler) .. Objective Evidence .. Prevailing Torque .. Process Control .. Repair .. Rework .. Specified Torque .. Supplier .. User .. Validation .. Verification.
2 Welding .. Wire Diameter (D) .. and Safety .. of Precedence .. Acceptance Requirements .. Requirements Flowdown .. Personnel Proficiency .. Conditions .. Indicator .. Classification Implied Relationships .. Not Specified .. Clearance .. Lighting .. Magnification Aids .. Rework/Repair .. Rework .. Repair .. Process Control Requirements .. Statistical Process Control (SPC) .. 62 APPLICABLE of Defense .. Society of MechanicalEngineers .. Discharge Association .. Organization forStandardization .. Industry Action Group .. Welding Society .. International .. 83 GENERAL AND FACILITY Discharge (ESD)Control Program .. Packaging .. Object Debris (FOD) .. Assembly Operations .. and Equipment .. and Packaging .. 94 MATERIALS AND Prior to Application.
3 Polymers .. and Sealants .. Requirements .. Bonding .. and Brazing Specifications .. Welding and Brazing ProcedureQualification .. Qualification of Personnel PerformingWelding or Brazing Operations .. 10 September and Harnesses .. Fiber Optic Cables .. Connector Assembly .. Crimping .. Splices .. Soldering .. Installation .. 105 Acceptability OF SURFACE .. and Adhesion .. Color and Gloss .. Cosmetic Flaws .. inspection .. Requirements .. 126 ELECTRONIC ENCLOSURE Installation .. Torque .. Hardware Installation Sequence/TorquePattern .. Tooling and Equipment .. Materials Applied to the Fastener System .. Bonding .. Material Preparation .. Conventional Rivets .. Blind Rivets .. Specialized Rivets .. Acceptance Requirements.
4 167 Acceptability Requirements .. General .. Surface Preparation .. Location .. Curing and Adhesion .. Content, Legibility and Permanency .. Assemblies and Subassemblies .. 228 22 FiguresFigure 1-1An Optical Fiber Cable .. 2 Figure 4-1 Wire Wrapped in the Opposite Directionto the Feed in Direction .. 11 Figure 4-2 Wire Kinked (B) .. 11 Figure 4-3 Filler Rod .. 11 Figure 6-1 Hardware Installation .. 13 Figure 6-2 Hardware Installation Order .. 13 Figure 6-3 Torquing Sequence Four Hole Pattern .. 14 Figure 6-4 Torquing Sequence Linear Pattern .. 14 Figure 6-5 Torquing Sequence Circular Pattern .. 14 Figure 6-6 Torque Stripe .. 15 Figure 6-7 Rivet Parts .. 15 Figure 6-8 Dimensions of Driven/Shop-Formed Head Universal .. 16 Figure 6-9 Dimensions of Driven/Shop-Formed Head Flush .. 16 Figure 6-10 Driven/Shop-Formed Head Concentricity Acceptable.
5 17 Figure 6-11 Malformed Rivet .. 17 Figure 6-12 Height and Diameter of Driven/Shop-Formed Head .. 17 Figure 6-13 Driven/Shop-Formed Head Concentricity Defect .. 17 Figure 6-14 Cracks in Driven/Shop-Formed Heads .. 17 Figure 6-15 Cracks in Driven/Shop-Formed Heads Defect 2, 3 .. 18 Figure 6-16 Cracks in Driven/Shop-Formed Heads Defect 2, 3 .. 18 Figure 6-17 Marred Manufactured Head .. 18 Figure 6-18 Flattened Manufactured Head .. 18 Figure 6-19 Open Heads (Gapping) .. 18 Figure 6-20 Head Heights Flush Rivets .. 19 Figure 6-21 Rivet Flash .. 19 Figure 6-22 Blind, Hollow Type Rivet .. 19 Figure 6-23 Sheet Deformed by Pressure .. 19 Figure 6-24 Sheet Deformed by Pressure .. 20 Figure 6-25 Sheet Deformed by Pressure .. 20 Figure 6-26 Sheet Deformed By Pressure .. 20 Figure 6-27 Sheet Expanded Internally .. 20 Figure 6-28 Sheet Injured by Rivet Gun or TrimFlush Shaver.
6 20 Figure 6-29 Countersinks Defect 2, 3 .. 20 Figure 6-30 Sheet Misalignment .. 20 TablesTable 1-1 Electrical Clearance .. 5 Table 1-2 Magnification Aids Wire Applications .. 5 Table 1-3 Magnification Aids Other Applications .. 6 Table 4-1 Welding and Brazing ReferenceDocuments .. 10 Table 4-2 Minimum Bend Radius Requirements .. 11 Table 6-1 Identification Markings on Conventional/Solid Rivets .. 15 Table 6-2 Dimensions of Driven/Shop Formed Head(mm [Inches]) .. 16 Table 6-3A-Max Dimension by Rivet Size .. 19 IPC-A-630 September 2013viAcceptability Standard for Manufacture, inspection and Testing of Electronic Enclosures1 ScopeThis Standard provides the requirements for the manufacture , inspection and test for electronic PurposeThis Standard has been written to direct the manufacturers and end users of electronic enclosures of electri-cal and electronic equipment to understand the best practices to meet requirements, ensuring the reliability and function ofthe end item assembly for its intended design electronic enclosure, for the purpose of this document, is defined as a chassis, box, top level assembly, high level assem-bly (HLA), functional unit, drawer, cabinet, or other designation, forming a top level system assembly.
7 An enclosure typi-cally consists of a combination of printed board assemblies (PBAs), cable and wire harness assemblies, and other electron-ics and/or mechanical components, and is typically tested as a functional unit. The enclosure includes the necessarymechanical and structural elements to protect and integrate the assembly into a finished system. Enclosures are often modu-lar components or sub-systems of larger systems, designed for quick replacement in the end-use ClassificationThis Standard recognizes that electrical and electronic assemblies are subject to classifications byintended end-item use. Three general end-product Classes have been established to reflect differences in producibility, com-plexity, functional performance requirements and verification ( inspection /test) frequency. It should be recognized that theremay be overlaps of equipment between Classes.
8 The user (customer) is responsible for defining the product Class. If theuser and manufacturer do not establish and document the acceptance Class, the manufacturer may do so. Accept and/or rejectdecisionsshall [D1D2D3]be based on applicable documentation such as contracts, drawings, specifications, standards andreference Class of product specified for the enclosure assemblyshall [D1D2D3]apply to all subassemblies unless as agreedbetween user and supplier (AABUS).Class 1 General Electronic ProductsIncludes products suitable for applications where the major requirement is function of the completed 2 Dedicated Service Electronic ProductsIncludes products where continued performance and extended life is required, and for which uninterrupted service is desiredbut not critical. Typically the end-use environment would not cause 3 High Performance Electronic ProductsIncludes products where continued high performance or performance-on-demand is critical, equipment downtime cannot betolerated, end-use environment may be uncommonly harsh, and the equipment should function when required such as lifesupport or other critical Measurement Units and ApplicationsAll dimensions and tolerances, as well as other forms of measurement (tem-perature, weight, etc.)
9 In this Standard are expressed in SI (System International) units with Imperial English equivalentdimensions provided in brackets. Dimensions and tolerances use millimeters as the main form of dimensional expression;Micrometers are used when the precision required make millimeters too cumbersome. Celsius is used to express tempera-ture. Weight is expressed in grams. Unless specifically required herein, actual measurement of specific part mounting anddetermination of percentages are not required except for referee purposes. For the purposes of determining conformance tothis specification, all specified limits in this Standard are absolute limits as defined in ASTM Definition of RequirementsThe wordshallis used in the text of this document wherever there is a requirement formaterials, process control, or acceptance of an electronic enclosure the wordshallleads to a hardware defect for at least one Class, the requirements for each Class are in brackets nextto 2013 IPC-A-6301