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Amphenol M.2(NGFF) Connector Brochure - Mouser …

2014 Amphenol Corporation Company Confidential All Rights ReservedAmphenol (NGFF) Connector 2014 Amphenol Corporation Company Confidential All Rights (NGFF) IntroductionThe form factor is used for Mobile Add-In cards. It is a natural transition from the Mini Card and Half Mini Card to a smaller form factor both in size and (NGFF) supports multiple functions. 2014 Amphenol Corporation Company Confidential All Rights Connector Description: 75 positions (67 active lines with 8 positions dedicated to mechanical keying) Single and Dual Mechanical keying allows for multiple standards Two rows of contacts @ pitch; bottom row staggered from top row Supports multiple standard card widths (12mm, 16mm, 22mm and 30mm) Supports multiple standard card lengths (16mm, 26mm, 30mm, 38mm, 42mm, 60mm, 80mm and 110mm) Module Description: specification standardizes multiple module sizes Allows for Single-or Dual-sided Components on modules Allows for Connectorized or Soldered-Down modules Will support multiple function add-in cards/modules SATA or PCIe x2 fits B key for SSD, WWAN, other non-storage devices PCIe x4 up to 4GB/s fitting M key modules for high performance (NGFF) Introduction 2014 Amphenol Corporation Company Confidential All Rights (NGFF) Application FieldsSmart TVServerSmart NetworkingTabletPC/UltrabookMobile PhoneGNNS/BT 2014 Amphenol Corporation Company Confidential All Rights Modular Card OverviewWhatt

• M.2 key B connector is suitable for applications that use WWAN+GNSS or Solid State Storage Devices (SSD). Module card types include 3042, 2230, 2242, 2260, 2280 and 22110. • M.2 key E connector is suitable for applications that use wireless connectivity including Wi -Fi, Bluetooth, NFC of GNSS. Module card types include 1630, 2230 and 3030.

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Transcription of Amphenol M.2(NGFF) Connector Brochure - Mouser …

1 2014 Amphenol Corporation Company Confidential All Rights ReservedAmphenol (NGFF) Connector 2014 Amphenol Corporation Company Confidential All Rights (NGFF) IntroductionThe form factor is used for Mobile Add-In cards. It is a natural transition from the Mini Card and Half Mini Card to a smaller form factor both in size and (NGFF) supports multiple functions. 2014 Amphenol Corporation Company Confidential All Rights Connector Description: 75 positions (67 active lines with 8 positions dedicated to mechanical keying) Single and Dual Mechanical keying allows for multiple standards Two rows of contacts @ pitch; bottom row staggered from top row Supports multiple standard card widths (12mm, 16mm, 22mm and 30mm) Supports multiple standard card lengths (16mm, 26mm, 30mm, 38mm, 42mm, 60mm, 80mm and 110mm) Module Description: specification standardizes multiple module sizes Allows for Single-or Dual-sided Components on modules Allows for Connectorized or Soldered-Down modules Will support multiple function add-in cards/modules SATA or PCIe x2 fits B key for SSD, WWAN, other non-storage devices PCIe x4 up to 4GB/s fitting M key modules for high performance (NGFF) Introduction 2014 Amphenol Corporation Company Confidential All Rights (NGFF) Application FieldsSmart TVServerSmart NetworkingTabletPC/UltrabookMobile PhoneGNNS/BT 2014 Amphenol Corporation Company Confidential All Rights Modular Card OverviewWhattypeofCards& applicationsusekeyA,E,B,M?

2 KeyModule Card TypeApplicationA1630, 2230, 3030 Wireless: Wi-Fi,BT, NFC, & or WiGigE1630, 2230, 3030,Wireless: Wi-Fi,BT, NFC, & or GNSSB3042, 2230, 2242, 2260, 2280, 22110 WWAN+GNSS or SSDM2242, 2260, 2280, 22110 SSD, PCIe or SATAKey G is designed for compliant devices and future Memory interface. 2014 Amphenol Corporation Company Confidential All Rights Modular Card OverviewNOTE:KEY OPTION IS A REPRESENTATION ONLYAND DOES NOT PROHIBIT ADDITION OPTIONSGENERAL TOLERANCE IS 1630-xx-ETOP 3026-XTOP SIDECOMPONENTAREA3026 TYPE 2226-XTOP SIDECOMPONENTAREA2226 TYPE 1216-XTOP SIDECOMPONENTAREA1216 TYPE 2230-xx-ETOP SIDECOMPONENTAREA2230 TYPE 3030-xx-ATOP SIDECOMPONENTAREA3030 TYPE 2242-xx-B-MTOP SIDECOMPONENTAREATOP SIDECOMPONENTAREA2242 TYPE 3042-xx-BTOP SIDECOMPONENTAREA3042 TYPE 2260-xx-MTOP SIDECOMPONENTAREA2260 TYPE 2280-xx-B-MTOP SIDECOMPONENTAREA228022110 TOP SIDECOMPONENTAREATYPE 22110-xx-B-M 2014 Amphenol Corporation Company Confidential All Rights (NGFF) Keying ConfigurationsMechanicalKey AssignmentPreferred & Optional Module Configurations 2014 Amphenol Corporation Company Confidential All Rights (NGFF)

3 Connector / Module Supported Matrix 2014 Amphenol Corporation Company Confidential All Rights Module Card / Connector Height RecommendationMid Line Connector HeightMid Line Single Sided ModuleMid Line Double Sided / Side Connector HeightSingle Sided : mmDouble Sided ModuleTop SideBottomSide 2014 Amphenol Corporation Company Confidential All Rights (NGFF) Connector Parametric Specifications 2014 Amphenol Corporation Company Confidential All Rights (NGFF) Connector Parametric Specifications 2014 Amphenol Corporation Company Confidential All Rights (NGFF) Connector Parametric Specifications 2014 Amphenol Corporation Company Confidential All Rights (NGFF) Connector Triple Insertion Module MethodStep 1: Move the module against the housing's chamberStep 2: Rotate the module to 20 degrees and insert it until the bottom of the connectorStep 3: Rotate the module to horizontal position by hand Step 4: Fix the module with a PCB screw to secure the module 2014 Amphenol Corporation Company Confidential All Rights (NGFF) Connector Module FixStand-offScrew 2014 Amphenol Corporation Company Confidential All Rights ReservedAmphenol (NGFF) Connector P/N SystemM D TXXXXXXXXXXXXC onnector height420 H= mm275 H= mm180 H= key IDA: key AB: key BE: key EM: key Spec01 um Au02 um Au03 Gold flashXXXS equence Code 2014 Amphenol Corporation Company Confidential All Rights (NGFF) Connector Signal Integrity Measurement Results1: Introduction This technical bulletin presents measured electrical performance data on 67pin PCIe Connector using frequency domain vector network analyzer (VNA) and time domain reflectometer (TDR) test equipment.

4 Measured parameters include calibrated S-parameters and TDR reflections due to impedance mismatch. Measurement SetupFreq domain test equipment: Agilent N5230C 4-port VNAFreq domain test frequency range: 10 MHz 20 GHz (2000 points).Time domain test equipment: Tektronix DSA8200 with 80E04 domain test rise time: 50ps(20-80%). Measurement Calibrationmethod: TRL calibration to the end of PCB Microstrip(De-embedding).The calibration helps to remove the test fixture results only included 67pin PCIe Connector with thefootprint and few PCB trace( ). All S-parameter test results Re-normalized to 85ohm reference impedance. 2014 Amphenol Corporation Company Confidential All Rights Reserved2. High Speed Signal AssignmentTop layerpins row(pin1~67)Bottom layerpins row(pin2~66)Pin33 GNDPin35&37 Diff PairPin39 GNDPin41&43 Diff PairPin45 GNDPin32 GNDPin34&36 Diff PairPin38 GNDPin40&42 Diff PairPin44 GNDTop layer pins rowBottom layer pins (NGFF) Connector Signal Integrity Measurement Results 2014 Amphenol Corporation Company Confidential All Rights Reserved3.

5 Test Fixture PCB LayoutNotes:Microstrip length each is 40mm onboth motherboard and substrate material is FR4,the DK is and DF is (NGFF) Connector Signal Integrity Measurement Results 2014 Amphenol Corporation Company Confidential All Rights Reserved4. DUTC alibration Board for PCIe Connector SI test (NGFF) Connector Signal Integrity Measurement Results 2014 Amphenol Corporation Company Confidential All Rights Reserved5. Differential Return Loss02468101214161820-40-35-30-25-20-15- 10-50frequency GHzMagnitude in dBDifferential Reflection Top Layer Pins Row: MB SideTop Layer Pins Row: DC SideBottom Layer Pins Row: MB SideBottom Layer Pins Row: DC SideSignal Integrity Spec (NGFF) Connector Signal Integrity Measurement Results 2014 Amphenol Corporation Company Confidential All Rights Reserved6. Differential Insertion Loss02468101214161820-10-9-8-7-6-5-4-3-2 -10frequency GHzMagnitude in dBDifferential Transmission Top Layer Pins RowBottom Layer Pins RowSignal Integrity Spec (NGFF) Connector Signal Integrity Measurement Results 2014 Amphenol Corporation Company Confidential All Rights Reserved7.

6 Differential NEXT02468101214161820-60-50-40-30-20-100 frequency GHzMagnitude in dBDifferential Near end Crosstalk In Top Layer Pins Row: MB SideIn Top Layer Pins Row: DC SideIn Bottom Layer Pins Row: MB SideIn Bottom Layer Pins Row: DC SideTop Layer to Bottom Layer: MB SideTop Layer to Bottom Layer: DC SideSignal Integrity Spec (NGFF) Connector Signal Integrity Measurement Results 2014 Amphenol Corporation Company Confidential All Rights Reserved8. Differential FEXT02468101214161820-60-50-40-30-20-100 frequency GHzMagnitude in dBDifferential Far end Crosstalk In Top Layer Pins Row: MB Side VictimIn Top Layer Pins Row: DC Side VictimIn Bottom Layer Pins Row: MB Side VictimIn Bottom Layer Pins Row: DC Side VictimTop Layer to Bottom Layer: MB Side VictimTop Layer to Bottom Layer: DC Side VictimSignal Integrity Spec (NGFF) Connector Signal Integrity Measurement Results 2014 Amphenol Corporation Company Confidential All Rights Reserved9. Differential Layer Pin35&37 Differential TDR @ Rise Time=50ps(20-80%)Time (ns)ohm MotherBoard to DaughterCardDaughterCard to MotherBoardCoaxial cableSMAPCB ConnectorPCB Layer Pin34&36 Differential TDR @ Rise Time=50ps(20-80%)Time (ns)ohm MotherBoard to DaughterCardDaughterCard to MotherBoardCoaxial cableSMAPCB TracePCB ConnectorLoadImpedance results met requirement of 85ohm connection (NGFF) Connector Signal Integrity Measurement Results 2014 Amphenol Corporation Company Confidential All Rights ReservedAmphenol (NGFF) connectors , , key ID A, B, E, M have been tooled up, drawings please refer to right side 2014 Amphenol Corporation Company Confidential All Rights (NGFF) connectors in board 2014 Amphenol Corporation Company Confidential All Rights Reserved key A Connector is suitable for applications that use wireless connectivity including Wi-Fi, Bluetooth, NFC, and WiGig.

7 Module card types include 1630, 2230 and 3030. key B Connector is suitable for applications that use WWAN+GNSS or Solid State Storage Devices (SSD). Module card types include 3042, 2230, 2242, 2260, 2280 and 22110. key E Connector is suitable for applications that use wireless connectivity including Wi-Fi, Bluetooth, NFC of GNSS. Module card types include 1630, 2230 and 3030. key M Connector is suitable for applications that use Host I/Fs supported by either PCIe or SATA, or Solid State Storage Devices (SSD). Module card types include 2242, 2260, 2280 Amphenol (NGFF) connectors - Key applications 2014 Amphenol Corporation Company Confidential All Rights ReservedSSD Storage Interface is the future! 2014 Amphenol Corporation Company Confidential All Rights Reserv


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