ASSOCIATION CONNECTING ELECTRONICS …

1 IPC-6012 Awith Amendment 1 Qualification and PerformanceSpecification for RigidPrinted BoardsASSOCIATION CONNECTINGELECTRONICS INDUSTRIES2215 Sanders Road, Northbrook, IL 60062-6135 Tel. Fax Amendment 1 July 2000A standard developed by IPCS upersedes IPC-6012 AOctober 1999 FOREWORDThis specification is intended to provide information on the detailed performance criteria of rigid printed boards. It super-sedes IPC-RB-276 and IPC-6012 and was developed as a revision to those documents. The information contained herein isalso intended to supplement the generic requirements identified in IPC-6011. When used together, these documents shouldlead both manufacturer and customer to consistent terms of s documentation strategy is to provide distinct documents that focus on specific aspects of electronic packaging this regard, document sets are used to provide the total information related to a particular electronic packaging topic.

2 Adocument set is identified by a four digit number that ends in zero (0) ( , IPC-6010).Included in the set is the generic information, which is contained in the first document of the set. The generic specificationis supplemented by one or multiple performance documents, each of which provide a specific focus on one aspect of thetopic or the technology to have all information available prior to building a board may result in a conflict in terms of technology changes, a performance specification will be updated, or new focus specifications will be added to the docu-ment set. The IPC invites input on the effectiveness of the documentation and encourages user response through completionof Suggestions for Improvement forms located at the end of each OF IPC QUALIFICATION ANDPERFORMANCE SPECIFICATIONS(6010 SERIES)IPC-6012 RIGIDIPC-6013 FLEXIPC-6014 PCMCIAIPC-6015 MCM-LIPC-6016 HDIIPC-6018 HIGHFREQUENCYT able of.

3 Classification and Type .. Type .. for Procurement .. , Plating Process and Final Finish .. 12 APPLICABLE .. Industry Standards .. Publications .. Society for Testing and Materials .. Lab .. Electrical ManufacturersAssociation .. Society for Quality Control .. Used in this Specification .. and Bonding Material forMultilayer Boards .. Bonding Materials .. Dielectric Materials .. Foils .. Core .. Platings and Coatings .. Solderability Preservative (OSP) .. Coating (Solder Resist) .. Fluids and Fluxes .. Inks .. Fill Insulation Material .. Planes, External .. Examination .. Imperfections .. and Coating Voids in the Hole .. Lands .. Adhesion .. Board Contact, Junction of GoldPlate to Solder Finish .. Dimensional Requirements.

4 Size and Hole Pattern Accuracy .. Ring and Breakout (Internal) .. Ring (External) .. and Twist .. Definition .. Width and Thickness .. Spacing .. Imperfections .. Surfaces .. Integrity .. Stress Testing .. for Microsectioned Couponsor Production Boards .. Tests .. Core (Horizontal Microsection) .. Simulation .. Strength, Unsupported ComponentHole Land .. Resist (Solder Mask) Requirements .. Resist Coverage .. Resist Cure and Adhesion .. Resist Thickness .. Requirements .. Withstanding Voltage .. Continuity and InsulationResistance .. Shorts to MetalSubstrate .. and Insulation Resistance (MIR) .. Prior to Solder ResistApplication .. After Solder Resist, Solder, orAlternative Surface Coating Application .. of Inner Layers After OxideTreatment Prior to Lamination.

5 Requirements .. Contamination .. Resistance .. 17 July 2000 IPC-6012A with Amendment Shock .. Testing .. of Thermal Expansion (CTE) .. Shock .. Insulation Resistance(As Received) .. Repairs .. 184 QUALITY ASSURANCE .. Test Coupons .. Tests .. Sampling Plan .. Tests .. Conformance Testing .. Selection .. Data .. Specifications .. 23 APPENDIX 24 FiguresFigure 3-1 Annular Ring Measurement .. 8 Figure 3-2A Breakout of 90 and 180 .. 8 Figure 3-2B Conductor Width Reduction .. 8 Figure 3-3 Separations at External Foil .. 10 Figure 3-4 Crack Definition .. 10 Figure 3-5 Typical Microsection Evaluation Specimen(Three Plated-Through Holes) .. 13 Figure 3-6 Negative Etchback .. 13 Figure 3-7 Metal Core to Plated-Through HoleSpacing .. 14 TablesTable 1-1 Default Requirements.

6 1 Table 3-1 Metal Core Substrate .. 4 Table 3-2 Final Finish, Surface Plating CoatingRequirements .. 5 Table 3-3 Plating and Coating Voids Visual Examination .. 6 Table 3-4 Edge Board Contact Gap .. 7 Table 3-5 Minimum Internal and External Annular Ring .. 8 Table 3-6 Plated-Through Hole Integrity After Stress .. 9 Table 3-7 Internal Layer Foil Thickness AfterProcessing .. 14 Table 3-8 External Conductor Thickness After Plating .. 14 Table 3-9 Solder Resist Adhesion .. 16 Table 3-10 Dielectric Withstanding Voltages .. 16 Table 3-11 Insulation Resistance .. 16 Table 4-1 Qualification Test Coupons .. 19 Table 4-2C=0 Sampling Plan (Sample Size forSpecific Index Value) .. 19 Table 4-3 Acceptance Testing and Frequency .. 20 Table 4-4 Quality Conformance Testing .. 23 IPC-6012A with Amendment 1 July 2000viQualification and Performance Specificationfor rigid Printed Boards1 ScopeThis specification covers qualification andperformance of rigid printed boards.

7 The printed board maybe single-sided, double-sided, with or without plated-through holes, multilayer with plated-through holes, multi-layer with or without buried/blind vias, and metal PurposeThe purpose of this specification is to pro-vide requirements for qualification and performance ofrigid printed Performance Classification and ClassificationThis specification recognizes thatrigid printed boards will be subject to variations in perfor-mance requirements based on end-use. The printed boardsare classified by a Performance Class of 1, 2 or 3. Perfor-mance classes are defined in IPC-6011, Generic Perfor-mance Specification for Printed Board TypePrinted boards without plated-throughholes (Type 1) and with plated-through holes (Types 2-6)are classified as follows.

8 Type 1 Single-Sided BoardType 2 Double-Sided BoardType 3 Multilayer board without blind or buried viasType 4 Multilayer board with blind and/or buried viasType 5 Multilayer metal core board without blind orburied viasType 6 Multilayer metal core board with blind and/orburied Selection for ProcurementFor procurement pur-poses, performance classshallbe specified in the procure-ment documentationshallprovide sufficient information tothe supplier so that he can fabricate the printed board andensure that the user receives the desired product. Informa-tion that should be included in the procurement documen-tation is shown in Selection (Default)The procurement documen-tation should specify the requirements that can be selectedwithin this specification; however, in the event selectionsare not made in the documentation, Table Material, Plating Process and Final Laminate MaterialLaminate material is identi-fied by numbers and/or letters, classes, types as specifiedby the appropriate specification listed in the Plating ProcessThe copper plating processwhich is used to provide the main conductor in the holes isidentified by one number as follows:1 Acid copper electroplating only2 Pyrophosphate copper electroplating only3 Acid and/or pyrophosphate copper electroplating4 Additive/electroless Final FinishThe final finish can be but is notlimited to one of the finishes specified below or a combi-nation of several platings and is dependent on assemblyprocesses and end-use.

9 Thickness, where required,shallbespecified in the procurement documentation unless listed inTable 3-2. Coating thickness may be exempted in Table 3-2( , tin-lead plate or solder coating). Designators for finalfinish are as follows:Table 1-1 Default RequirementsCategoryDefault SelectionPerformance ClassClass 2 MaterialEpoxy-Glass LaminateFinal FinishFinish X (Electrodeposited tin-lead, fused or solder coated)Minimum Starting Foil1/2 oz. for all internal and exter-nal layers except Type 1 whichshallstart with 1 Foil TypeElectrodepositedHole DiameterTolerancePlated, componentsPlated, via onlyUnplated( ) 100 m [ in](+) 80 m [ in], (-) norequirement, (may be totallyor partially plugged)( ) 80 m [ in]Conductor Width 2 requirements per Spacing 2 requirements per Separation90 m [ in] minimumLateral ConductorSpacing100 m [ in] minimumMarking InkContrasting color, nonconductiveSolder ResistNot applied, if not specifiedSolder Resist, specifiedClass T of IPC-SM-840 if classnot specifiedSolderability TestCategory 2 of J-STD-003 Test Voltage, InsulationResistance40 VoltsQualification notspecifiedSee IPC-6011 July 2000 IPC-6012A with Amendment 11 SSolder Coating.

10 (Table 3-2)TElectrodeposited Tin-Lead,(fused) .. (Table 3-2)XEither Type S or T .. (Table 3-2)TLUE lectrodeposit Tin-Lead(unfused) .. (Table 3-2)GGold Electroplate for Edge BoardConnectors .. (Table 3-2)GSGold Electroplate for Areas to beSoldered .. (Table 3-2)NNickel for Edge BoardConnectors .. (Table 3-2)NBNickel as a Barrier to Copper-TinDiffusion .. (Table 3-2)OSPO rganic Solderability Protector (tarnish and sol-derability protection during storage and assem-bly processes) .. (Table 3-2)CBare Copper .. (Table 3-2)SMOBC Solder Mask over Bare CopperENElectroless NickelEGElectroless GoldIGImmersion GoldISImmersion SilverITImmersion TinTNTin-NickelRRhodiumPPalladiumTPTin PlatingYOther2 APPLICABLE DOCUMENTSThe following specifications of the revision in effect at thetime of order form a part of this document to the extentspecified herein.