ASSOCIATION CONNECTING ELECTRONICS …

1 IPC J-STD-004 ARequirements forSoldering FluxesA standard developed by the Flux Specifications Task Group (5-24a)of the Assembly and Joining Processes Committee (5-20) of IPCU sers of this publication are encouraged to participate in thedevelopment of future :IPC2215 Sanders RoadNorthbrook, IL 60062-6135 Phone (847) 509-9700 Fax (847) 509-9798 Supersedes:J-STD-004 - January 1995 Amendment 1 - April 1996 ASSOCIATION CONNECTINGELECTRONICS INDUSTRIES January 27, 2004 Table of Contents1 SCOPE AND .. 12 APPLICABLE .. Industry Standards .. Society for Testing and Materials(ASTM) .. Standards Organization .. Conference of StandardsLaboratories (NCSL) .. Technologies .. Industiallen Norm .. 23 GENERAL .. and Definitions .. Form .. Inorganic Flux .. Organic Flux .. Resin Flux .. Rosin Flux .. System .. Flux Materials of Composition .. Flux Type .. Flux Form.

2 Testing .. Copper Mirror Test .. Qualitative Halide Tests (Optional) .. Quantitative Halide Content Tests .. Qualitative Corrosion Test .. Surface Insulation Resistance (SIR) Test .. Electrochemical Migration (ECM) Test .. Fungus Resistance Test (Optional) .. Flux Solids (Nonvolatile) Determination .. Conformance Testing .. Acid Value Determination .. Flux Specific Gravity Determination .. Determination of Viscosity of Paste(Tacky) Flux .. Visual .. Testing .. Wetting Balance Test (Optional) .. Spread Test Liquid Flux (Optional) .. 64 QUALIFICATIONS AND QUALITY for Inspection .. Responsibility for Compliance .. Test Equipment and Inspection Facilities .. Inspection Conditions .. of Inspections .. Inspection .. Sample Size .. Inspection Routine .. Conformance Inspection .. Sampling Plan .. Rejected Lots.

3 Inspection .. of Fluxes for Testing .. Liquid Fluxes .. Solid Fluxes .. Paste Flux .. Solder Paste .. Other Materials .. 8 Appendix 9 Appendix 11 FiguresFigure 3-1 Flux Activity Classification by CopperMirror Test .. 4 Figure B-1 Wetting Balance Curve .. 12 TablesTable 1-1 Flux Identification System .. 2 Table 3-1 Test requirements for Flux Type Classification . 4 Table 4-1 Classification, Quality Conformance andPerformance Testing for Flux .. 7 Table 4-2 Preparation of Flux Forms for Testing .. 7 Table B-1 Spread Area requirements .. 12 IPC J-STD-004 AJanuary 2004ivRequirements for soldering Fluxes1 SCOPE AND ScopeThis standard prescribes general requirementsfor the classification and testing of fluxes for high qualitysolder interconnections. This standard is a flux character-ization, quality control, and procurement document for fluxand flux-containing PurposeThis standard defines the classification ofsoldering materials through specifications of test methodsand inspection criteria.

4 These materials include: liquid flux,paste flux, solder paste flux, solder preform flux, and fluxcored solder. It is not the intent of this standard to excludeany acceptable flux or soldering aid material; however,these materials must produce the desired electrical andmetallurgical requirements for fluxes are defined in general terms forstandardized classification. Appendix B has additionalinformation that will help users understand some of therequirements of this standard. In practice, where morestringent requirements are necessary or other manufactur-ing processes are used, such as soldering with alloys otherthan tin/lead, the usershalldefine these as are unresolved issues related to fluxes that are evalu-ated and used with certain lead free alloys. While somecriteria may be applicable to testing with lead free alloys,users need to recognize that other testing may be revisions to this standard will address those issueswhen sufficient data is DesignationFor ordering purposes and designationby other specifications, the following flux identificationsystemshallbe used (see Table 1-1).

5 Interpretation Shall, the imperative form of theverb, is used throughout this standard whenever a require-ment is intended to express a provision that is from a shall requirement may be considered ifsufficient information is supplied to justify the words should and may are used whenever it isnecessary to express nonmandatory provisions. Will isused to express a declaration of assist the reader, the word shall is presented in APPLICABLE DOCUMENTSThe following documents of the issue currently in effectform a part of this specification to the extent specifiedherein. In the event of a conflict between the text of thisdocument and the references cited herein, the text of thisdocument takes precedence. Nothing in this document,however, supersedes applicable laws and regulations unlessa specific exemption has been IPC1 IPC-T-50 Terms and Definitions for Interconnecting andPackaging electronic CircuitsIPC-TM-650 Test Methods of Acid Value of Liquid SolderFlux - Potentiometric and Visual Titration Halide Content of soldering Fluxes and Induced Corrosion (Copper Mirror Method) of Halides in Flux, Silver Content, Content, Quantitative (Chloride and Bro-mide) Fluorides by Spot Test, Fluxes - Fluoride Concentration, Fluxes - Liquid Flux Activity, Wetting Balance Paste Flux Viscosity - T-Bar Spindle Test, Liquid or Extracted Solder Flux,Solder Paste and Extracted Cored Wires or Resistance Printed Wiring Insulation Resistance (SIR)

6 , Electrochemical Migration Resistance , Joint Industry Standards1J-STD-003 Solderability Tests for Printed American Society for Testing and Materials (ASTM)3 ASTM D-465 Standard Test Methods for Acid Number ofNaval Stores Products Including Tall Oil and Other RelatedProducts1. Current and revised IPC Test Methods are available through IPC-TM-650 subscription and on the IPC Web site ( ).3. 2004 IPC J-STD-004A1