ASSOCIATION CONNECTING ELECTRONICS …

1 J-STD-005 Requirements forSoldering PastesA joint standard developed by the Solder Paste Task Group(5-22b) of IPCU sers of this standard are encouraged to participate in thedevelopment of future :EIAE ngineering Department2500 Wilson BoulevardArlington, VA 22201 Phone (703) 907-7500 Fax (703) 907-7501 IPC3000 Lakeside Drive, Suite 309 SBannockburn, Illinois60015-1219 Tel (847) 615-7100 Fax (847) 615-7105 ASSOCIATION CONNECTINGELECTRONICS INDUSTRIES March 21, 1995 Table of .. Standards .. Standards Organization .. Society for Testing Materials .. Requirements .. Description for Powder Particle Size .. Percent .. Test .. Ball Test .. Test .. ASSURANCE for of Report Form .. Inspection .. FOR Life .. 8 FiguresFigure 1 Slump test stencil thickness mm.

2 4 Figure 2 Slump test stencil thickness mm .. 5 Figure 3 Solder ball test standards .. 6 Figure 4 Solder Paste Inspection Report 7 TablesTable 1 Standardized Solder Paste Description .. 2 Table 2A% of Sample by Weight Nominal 3 Table 2B% of Sample by Weight Nominal 3 Table 3 Solder Paste Inspection .. 8 Table 4 User Inspection for Solder Paste .. 8J-STD-005 January 1995ivRequirements for Soldering ScopeThis standard prescribes general requirementsfor the characterization and testing of solder pastes used tomake high quality electronic interconnections. This specifi-cation is a quality control document and is not intended torelate directly to the material s performance in the manu-facturing PurposeThis standard defines the characteristicsof solder paste through the definitions of properties andspecification of test methods and inspection criteria.

3 Thematerials include solder powder and solder paste fluxblended to produce solder paste. Solder powders are clas-sified as to shape of the particles and size distribution ofthe particles. It is not the intent of this standard to excludeparticle sizes or distributions not specifically listed. Theflux properties of the solder paste, including classificationand testing, shall be based on J-STD-004. The require-ments for solder paste are defined in general terms. In prac-tice, where more stringent requirements are necessary,additional requirements shall be defined by mutual agree-ment between the user and supplier. Users are cautioned toperform tests (beyond the scope of this specification) todetermine the acceptability of the solder paste for APPLICABLE DOCUMENTSThe following documents of the issue currently in effect,form a part of this specification to the extent Joint Standards1J-STD-001 Soldering requirements for electronic Inter-connections (Supercedes IPC-S-815)J-STD-004 Requirements for Soldering Fluxes (Super-cedes IPC-SF-818)J-STD-006 Requirements for Alloys and Solder Military2 MIL-STD-45662 Calibration Systems International Standards Organization3 ISO 9002 Quality Systems Model for Quality Assurancein Production and InstallationISO 10012-1 Quality Assurance requirements for measur-ing equipment Part 1.

4 Management of measuring IPC1 IPC-A-20 Fine pitch stencil pattern for pitch stencil pattern for and Definitions for Interconnecting andPackaging electronic CircuitsIPC-TM-650 Test Methods Powder Particle Size Distribution Powder Particle Size Distribution Measuring Microscope Powder Particle Size Distribution Optical Image Analyzer of Maximum Solder Powder Par-ticle Paste Metal Content by Paste Viscosity T-Bar Spin SpindleMethod (Applicable for 300,000 to 1,600,000 centipoise) Paste Viscosity T-Bar Spindle Method(Applicable at less than 300,000 centipoise) Paste Viscosity Spiral Pump Method(Applicable for 300,000 to 1,600,000 centipoise) Paste Viscosity Spiral Pump Method(Applicable at less than 300,000 centipoise) Paste Slump Paste Solder Ball Paste Tack Paste Wetting American Society for Testing Materials4 ASTM D-1210 Fineness of Dispersion of Pigment VehicleSystems1.

5 Application for copies should be addressed to the IPC, 3000 Lakeside Drive, Suite 309S, Bannockburn, Illinois 60015-12192. Publications are available from Standardization Documents Order Dept., Building 4D, 700 Robbins Avenue, Philadelphia, PA 19111-50903. Publications are available from the International Standards Organization 1 Rue de Varembe, Case 56, CH-1211 Geneve 20 Switzerland4. American Society for Testing Materials, 1916 Race Street, Philadelphia, PA 19103-1187 January 1995J-STD-0051