ATHENA User’s Manual

1 SILVACO International4701 Patrick Henry Drive, Bldg. 1 July 20, 2005 Santa Clara, CA 95054 Version (408) 567-1000 FAX:(408) 496-6080E-MAIL: User s Manual 2D PROCESS SIMULATION SOFTWARESILVACO InternationaliiThe information contained in this document is subject to change without International MAKES NO WARRANTY OF ANY KIND WITH REGARD TO THIS MATERIAL, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTY OF FITNESS FOR A PARTICULAR PURPOSE. SILVACO International Inc. shall not be held liable for errors contained herein or for incidental or consequential damages in connection with the furnishing, performance, or use of this document contains proprietary information, which is protected by copyright laws of the United States. All rights are reserved. No part of this document may be photocopied, reproduced, or translated into another language without the prior written consent of SILVACO Alliance, ANALOG EXPRESS, ATHENA , ATHENA Interpreter, ATLAS, ATLAS Interpreter, Automation Tools, Beacon, Blast, Blaze/Blaze3D, CELEBRITY, Circuit Optimizer, Clarity CLEVER, DeckBuild, DevEdit, DevEdit3D, Device3D, DISCOVERY, Dragon, Elite, Envoy, EXACT, Expert, ExpertViews, FastBlaze, FastGiga, Connecting TCAD to Tapeout, FastLargeSignal,FastMixedMode, FastNoise, FastSpice, Ferro, Promost-Rel, Frontier, Giga2D/3D, Guardian, Harmony, HIPEX-C, HIPEX-CRC, HIPEX-Net, HIPEX-RC, HyperFault, Interactive Tools, Interpreter, Laser, Legacy, LISA, Luminous2D/3D, Manufacturing Tools, MaskViews, Maverick, MC Depo/Etch, MC Implant, MERCURY, MixedMode2D/3D, Mocasim, Nomad.

2 Optolith, PROMOST, Flash, PSTATS, Quantum2D/3D, QUEST, Radiant, Ranger, Ranger3D, RelLib, RelStats, RESILIENCE, Savage, Scholar, Scout, SDDL, SFLM, Silicides, SILOS, Simulation Standard, SmartCell, SmartCore, SmartLib, SmartSpice, SmartSpice RadHard, SmartSpice RF, SmartStats, SPAYN, Spice Modeling, Spirit, S-Pisces, SSuprem3, SSuprem4, stellar , TCAD Driven CAD, TFT2D/3D, TonyPlot, TonyPlot3D, Twister, UTMOST, VCSELS, VICTORY, Virtual Wafer Fab, VYPERAll other trademarks mentioned in this Manual are the property of their respective owners. 1990, 1991, 1992, 1993, 1994, 1995, 1996, 1997, 1998, 1999, 2000, 2001, 2002, 2003, 2004, 2005 by SILVACO International, InternationalWe welcome your evaluation of this Manual . Your comments and suggestions help us to improve our publications. If you have any responses to the questions below, please let us know.

3 Write your observations down and send complaints, bug reports, suggestions or comments to the e-mail address listed below. Is this Manual technically accurate? Are the concepts and wording easy to understand? Is the size of this Manual convenient for you? Is the Manual 's arrangement convenient for you? Do you consider this Manual to be easily readable?Please add any additional relevant comments and fax your comments to:SILVACO InternationalAttention: Technical Publications4701 Patrick Henry Drive, Building 1 Santa Clara, CA 95054(408) can also e-mail to us at or visit our website at Comment SheetSILVACO Internationaliv Style ConventionsFont Style/ConventionDescriptionExample This represents a list of items or terms. Bullet A Bullet B Bullet represents a set of directions to perform an open a door:1. Unlock the door by inserting the key into Turn key Pull out the key from the Grab the doorknob and turn clockwise and pull.

4 This represents a sequence of menu options and GUI buttons to perform an OpenCourier This represents the commands, parameters, and variables BIRTHDAYNew Century Schoolbook BoldThis represents the menu options and buttons in the Century Schoolbook ItalicsThis represents the :This represents the additional important : Make sure you save often when working on a CENTURY SCHOOLBOOK IN SMALL CAPSThis represents the names of the product , ATLAS, EXPERT, GATEWAY, HIPEX, SMARTSPICE, stellar , and to Read this ManualSILVACO InternationalvChapter 1 Introduction .. 1-1 : ATHENA Overview.. : Using This Manual .. : Technical Support .. : ATHENA Features and Capabilities .. : Using ATHENA With Other SILVACO Software .. : The Value Of Physically-Based Simulation .. 1-4 Chapter 2 Tutorial.

5 : Getting Started.. : Running ATHENA Under DeckBuild .. : Loading And Running ATHENA Standard Examples .. : Operation Modes .. : Interactive Mode With DeckBuild .. : Batch Mode With Deckbuild .. : No Windows Batch Mode With Deckbuild .. : Running ATHENA inside DeckBuild .. : Creating a Device Structure Using ATHENA .. : Procedure Overview .. : ATHENA Input/Output .. : Creating An Initial Structure .. : Choosing Models In SSUPREM4 .. : Implantation, Oxidation, RTA, Diffusion and Epitaxy .. : The Reason for Multiple Models for Each Process .. : Choosing an Appropriate Model Using the Method Statement .. : Changing the Method Statement During the Process Flow .. : Modelling the Correct Substrate Depth .. : Simulating Rapid Thermal Anneals (RTA) Notes .. : Simulating Oxidation .. : Simulating the Epitaxy Process.. : Calibrating ATHENA for a Typical MOSFET Flow.

6 : Input Information .. : Tuning Oxidation Parameters .. : Tuning Implantation Parameters .. : Tuning Diffusion Parameters.. : Related Issues on using the Device Simulator ATLAS for MOS Process Tuning .. : Calibrating ATHENA for a Typical Bipolar Process Flow .. : Tuning Base and Collector Currents All Regions .. : Tuning the Base Current All Regions .. : Tuning the Collector Current All Regions .. : The Base Current Profile Medium Injection .. : The Base Current Profile Low Injection .. : Using ATHENA for Simulating SiGe Process .. : METHOD Statement .. : MATERIAL Statement .. 2-54 Table of ContentsATHENA User s ManualviSILVACO International : DEPOSIT Statement .. : DIFFUSE Statement.. : Using Advanced Features of ATHENA .. : Structure Manipulation Tools .. : Deposition and Wet/Dry Etching using the Physical Models in ATHENA /ELITE.

7 : MaskViews Interface .. : Using ATHENA /OPTOLITH .. : Overview .. : Creating A Mask .. : Illumination System .. : The Projection System .. : Imaging Control .. : Defining Material Properties .. : Structure Exposure.. : CD Extraction, Smile Plots, And Looping Procedures .. : Adaptive Meshing .. : Introduction to Mesh Adaption .. : Interface Mesh Control .. 2-89 Chapter 3 SSUPREM4 Models .. : Diffusion Models .. : Mathematical Description .. : The Fermi Model .. : Impurity Segregation Model .. : The Two Dimensional Model .. : The Fully Coupled Model .. : Electrical Deactivation and Clustering Models .. : Grain-based Polysilicon Diffusion Model .. : Advanced Diffusion Models.. : Classical Model of Dopant Diffusion (CDD) .. : Solid Solubility Model .. : Interstitials Clusters Model (IC) .. : Vacancy Cluster Model (VC) .. : Electrical Deactivation and Clustering Models (DDC).

8 : Typical Examples .. : Oxidation Models .. : Numerical Oxidation Models .. : Compress Model .. : Viscous Model .. : Linear Rate Constant .. : Parabolic Rate Constant .. : Mixed Ambient Oxidation .. : Analytical Oxidation Model .. : Recommendations for Successful Oxidation Simulations .. : Silicidation Model .. : Ion Implantation Models.. : Analytic Implant Models .. : Multi-Layer Implants .. : Creating Two-Dimensional Implant Profiles .. : Monte Carlo Implants .. : Ion Implantation Damage .. 3-87 SILVACO Internationalvii Table of : Stopping Powers in Amorphous Materials and Range Validation .. : Deposition Models.. : Deposition of Doped Layers .. : Grid Control During Deposit .. : Epitaxy Simulation.. : Etching Models .. : Compound Semiconductor Simulation .. : Diffusion Models .. : Implantation Models .. : SiGe/SiGeC Simulation.

9 : Deposition of SiGe/SiGeC Epitaxial Layer .. : Boron Diffusion in SiGe/SiGeC .. : Boron Transient Diffusion Suppression by Carbon Incorporation Models.. : Stress Models .. 3-97 Chapter 4 ELITE Models .. : Overview.. : String Algorithm .. : Deposition Models.. : Conformal Deposition .. : CVD Deposition.. : Unidirectional Deposition .. : Dual Directional Deposition .. : Hemispheric Deposition .. : Planetary Deposition .. : Conical Deposition .. : Monte Carlo Deposition.. : Custom Deposition Models .. : Etch Models .. : Isotropic Etch Model .. : RIE Model .. : Dopant Enhanced Etching .. : Plasma Etch Model .. : Monte Carlo Etching Model .. : Reflow Model .. : Chemical Mechanical Polish (CMP) .. : Hard Polish Model .. : Soft Polish Model .. 4-23 Chapter 5 OPTOLITH Models .. : Overview.. : The Imaging Module.

10 : Optical System.. : Discretization Errors .. : Mesh .. : Computation Time .. : The Exposure Module .. : Photoresist Bake Module .. : The Development Module .. : Dill s Development Model .. 5-13 ATHENA User s ManualviiiSILVACO International : Kim s Development Model .. : Mack s Development Model .. : Trefonas Development Model .. : Hirai s Development Model .. 5-14 Chapter 6 Statements .. : Overview .. : Abbreviations .. : Continuation Lines .. : Comments .. : General Syntax Description .. : Command Line Parsing .. : ATHENA Statements List .. : Structure and Grid Initialization Statements .. : Structure and Mesh Manipulation Statements .. : Simulation Statements .. : Model Statements .. : Special DECKBUILD Statements .. : Post-processing Statements .. : Execution Control Statements .. : Obsolete Statements .. : Standard and User-Defined Materials.