難削材加工のための切削 ... - cmi.iis.u-tokyo.ac.jp

1 Nagoya Institute of Technology Cutting Tool Edge Design for Machining of Difficult-to-Cut Materials Nagoya Institute of Technology CFRP Pulse Laser Grinding(PLG)Nagoya Institute of Technology Nagoya Institute of Technology WG 14 Nagoya Institute of Technology 1/2 min Inconel718( 400xL600) Inconel718 250xL15 Nagoya Institute of Technology Developed SPRT Nagoya Institute of Technology Nagoya Institute of Technology R : mRa : mRa : mRaTool: WC-Co 10mmDepth of cut: rate: speed: 50mTool circumferential velocity:2mNagoya Institute of Technology cBN 1/10 Commercial insert( )Well-designed insert( )Cutting speed: 150 250 mFeed rate: mm/revDepth of cut.

2 2 mmNagoya Institute of Technology Nagoya Institute of Technology StiffnessHardnessDiamondcBNCeramicsCerme tCemented carbideHSSC oated = Rake faceFlank facecBNinsert (Cutting ability) Edge force, Thrust force Nagoya Institute of TechnologyBurrInconel718 Burr Inconel718 Nagoya Institute of Technology [ , ,30,350(1964)273.] ToolExtrudedBUE [ , , (1961)69.] Nagoya Institute of Technology 1mmWorkpieceWorkpieceCameraToolToolChip1 mmCommercial insert( )Well-designed insert( ) Nagoya Institute of TechnologyDAGJEKHIF -line -lineB4 BUEC1t 1t0ts a 2tcWdqq+qppp xyBUERake faceChamfer faceWidth of cut bxy0xyBEF0 BEFb / 2 BUE a Nagoya Institute of TechnologyToolWorkpieceChipCameraWorkpie ceToolChip flowWorkpieceTool 1mm1mmCommercial insert( )Well-designed insert( )

3 Nagoya Institute of TechnologyCFRP Nagoya Institute of Technology CFRP Cutting toolCutting ChipCarbon fiberHInitial edge profileThrust force1002005101520250 Edge height [ m]Cutting distance [m] WC-Co, =0 PCD, =0 1002001002003004005000 Thrust force [N]Cutting distance [m] WC-Co, =0 PCD, =0 C-FRP ( :H) Nagoya Institute of TechnologyMode 1 Cutting toolInitial edge profileMicrochippingand plastic deformation. CFRP CFRP Mode 2 Severe tool wear at flank toolInitial edge profileC-FRP CFRP Nagoya Institute of TechnologyCutting distanceThrust forceTool lifeMaterial AMaterial BMaterial C Demerit MeritCFRP + C-FRP CFRP Nagoya Institute of Technology 2 High wear resistance materialLow wear resistance material Tool wear progressionHigh reduction effect of

4 Burnishing areaAntigrowth effect of tool wearC-FRP CFRP Nagoya Institute of mmCuttingdirectionDown cutFiberorientation0 CFRP CFRP 100 mPCDWC-Co :10 : 20 Cutting tool WC-Co PCD PCD/WC-Co Nagoya Institute of Technology1002003004001002003004005000 Cutting distance [m]Thrust force [N] WC-Co PCD PCD/WC-Co t=100 m 2 1002003004001002003004005000 Cutting distance [m]Flank wear width [ m] WC-Co PCD PCD/WC-Co t=100 m 2 50m 2 PCD 25% 1 CFRP Nagoya Institute of Technology50 m 200 m 0000000000 PCDRake faceFlank faceInitial edge profile0000000000 Rake faceFlank faceInitial edge profilePCDWC-Co 2 21 mBurnishing area14 mBurnishing area CFRP 50 m 1 CFRP Nagoya Institute of Technology 3 PCD CFRP Nagoya Institute of Technology 3 PCD 000000000000000000000000000000000000100 m PCD50 m100 m200 m300 m400

5 MBefore000000000000000000000000000000000 000 PCD = 90 mPCDPCDWC-CoPCDWC-Co 90 m 50 m PCD 000000000000000000000000000000000000 = 50 m CFRP Nagoya Institute of TechnologyCutting distanceThrust forceWC-CoPCDPCDWC-CoWC-CoPCD 2 CFRP CFRP Nagoya Institute of Technology000000000000000000000000000000 000000000000000000000000000000 DIA/WC-Co ( = 20 m)50 m100 m200 m300 mBefore PCD/WC-Co ( = 90 m)100 m1002003004001002003004005000 Cutting distance [m]Thrust force [N] DIAcoat/WC-Co PCD/WC-Co t=90 m1002003004001002003004005000 Cutting distance [m]Principal force [N] DIAcoat/WC-Co PCD/WC-Co t=90 m CVD 2 CVD 2 CFRP Nagoya Institute of Technology WC-CoPCD Cutting distanceThrust forceTool lifeMaterial AMaterial BMaterial C + 2 CFRP Nagoya Institute of Technology Pulse Laser Grinding(PLG)Nagoya Institute of Technology 1010W/cm2 (Laser ablation)

6 Time elapsed,sPower density, W/cm2 TpiTpd Pulse Laser Grinding(PLG)Nagoya Institute of Technology Pulse Laser Grinding(PLG) Advantages ( / ) ( / ) Disadvantages ( ) ( ) Disadvantages ( ) ( ) Advantages ( ) ( ) ? Nagoya Institute of Technology Pulse Laser Grinding(PLG)Pulse Laser Grinding(PLG) Nagoya Institute of Technology Pulse Laser Grinding(PLG)PLG 0 Nagoya Institute of Technology Pulse Laser Grinding(PLG)PLG ( ) Nagoya Institute of Technology Pulse Laser Grinding(PLG)PLG PLG cBN Nagoya Institute of Technology Pulse Laser Grinding(PLG)

7 PcBN [ 5000 ]5 m20 mPLG PcBN PLG Nagoya Institute of Technology Pulse Laser Grinding(PLG)LAbrasivegrainAl2O3 Grain size#60(212 250 m)Discharge MPaProcess time3 secDistanceL450 mmConditionsNozzleAcrylic resinPcBNGrainTool edge InsertDiamond wheel ground toolLaser processed toolPLG cBN Nagoya Institute of Technology Pulse Laser Grinding(PLG)PLG cBN 20 m20 mChippingblastDiamond wheel ground20 m20 mblastLaser processedNagoya Institute of Technology Pulse Laser Grinding(PLG) PLG PLG cBN Nagoya Institute of Technology Pulse Laser Grinding(PLG) m m m ( ) Rz : mRz.

8 MPLG cBN Nagoya Institute of Technology Pulse Laser Grinding(PLG)PLG cBN [ 50 ]200 m[ 50 ]200 m[ 100 ]100 m[ 100 ]100 mPLG Nagoya Institute of Technology Pulse Laser Grinding(PLG)CVD Nagoya Institute of Technology Pulse Laser Grinding(PLG)CVD Nagoya Institute of Technology Pulse Laser Grinding(PLG)CVD Nagoya Institute of Technology Pulse Laser Grinding(PLG) CVD Nagoya Institute of Technology