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DRV3201-Q1 3 Phase Motor Driver-IC for …

RSTNPHxCDRVOFFBLDC MotorControl Logicand Safety / Diagnostic Internal Supply3 Phase CompENERRBOOSTVSSWROIPyINyGHSxSHSxSLSxGL SxO3,43 PowerStagex = = , ILSxRIControllerGNDLS_BB_ENVCC5 VCC3 SPIADREFB attery Voltage3 Phase Gate DriverBoost Converter2 1st Current Sense Amp2 2nd Current Sense AmpShift Buffer2 Current ShuntO1,2 ProductFolderOrderNowTechnicalDocumentsT ools &SoftwareSupport &CommunityAn IMPORTANTNOTICEat the end of this datasheetaddressesavailability,warranty, changes,use in safety-criticalapplications,intellectual propertymattersand JULY2017 DRV3201-Q13 PhaseMotorDriver-ICfor AutomotiveSafetyApplications11 Features1 Qualifiedfor AutomotiveApplications AEC-Q100 TestGuidanceWiththe FollowingResults: DeviceTemperatureGrade1: 40 C to 125 CAmbientOperatingTemperature DeviceHBMESDC lassificationLevel2 DeviceCDMESDC lassificationLevelC3 3 PhaseBridgeDriverfor MotorControl Drives6 SeparateN-ChannelPowerMOSFETsup to 250-nCGateCharge Programmable140-mAto 1-A GateCurrentDrive(Source/Sink)for EasyOutputSlopeA

PACKAGE OPTION ADDENDUM www.ti.com 29-Jul-2017 Addendum-Page 1 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan

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Transcription of DRV3201-Q1 3 Phase Motor Driver-IC for …

1 RSTNPHxCDRVOFFBLDC MotorControl Logicand Safety / Diagnostic Internal Supply3 Phase CompENERRBOOSTVSSWROIPyINyGHSxSHSxSLSxGL SxO3,43 PowerStagex = = , ILSxRIControllerGNDLS_BB_ENVCC5 VCC3 SPIADREFB attery Voltage3 Phase Gate DriverBoost Converter2 1st Current Sense Amp2 2nd Current Sense AmpShift Buffer2 Current ShuntO1,2 ProductFolderOrderNowTechnicalDocumentsT ools &SoftwareSupport &CommunityAn IMPORTANTNOTICEat the end of this datasheetaddressesavailability,warranty, changes,use in safety-criticalapplications,intellectual propertymattersand JULY2017 DRV3201-Q13 PhaseMotorDriver-ICfor AutomotiveSafetyApplications11 Features1 Qualifiedfor AutomotiveApplications AEC-Q100 TestGuidanceWiththe FollowingResults: DeviceTemperatureGrade1.

2 40 C to 125 CAmbientOperatingTemperature DeviceHBMESDC lassificationLevel2 DeviceCDMESDC lassificationLevelC3 3 PhaseBridgeDriverfor MotorControl Drives6 SeparateN-ChannelPowerMOSFETsup to 250-nCGateCharge Programmable140-mAto 1-A GateCurrentDrive(Source/Sink)for EasyOutputSlopeAdjustment 7-V to 40-VComplianceon All FET DriverPinsto HandleInductiveUndershootingandOvershoot ing SeparateControlInputfor EachPowerMOSFET PWMF requencyup to 30 kHz Supports100%DutyCycleOperation 30 V ProperLow SupplyVoltageOperationDue toIntegratedBoostConverterfor Gate-DriverVoltageGeneration LogicFunctionalDownto 3 V ShortCircuitProtectionWithVDS-Monitoring andAdjustableDetectionLevel Two IntegratedHighAccuracyCurrentSenseAmplif iersWithTwo Gain-ProgrammableSecondStagefor HigherResolutionat Low LoadCurrentOperation Overvoltageand UndervoltageProtection Shoot-ThroughProtectionWithProgrammableD eadTime ThreeRealTimePhaseComparators

3 OvertemperatureWarningand ShutDown SophisticatedFailureDetectionand HandlingThroughSPI Interface SleepModeFunction Resetand EnableFunction Package:64-pinHTQFPP owerPAD 2 Applications AutomotiveSafetyCriticalMotor-ControlApp lications ElectricalPowerSteering(EPS,EHPS) ElectricalBrake/BrakeAssist Transmission Oil-Pump IndustrialSafetyCriticalMotor-ControlApp lications3 DescriptionThe bridgedriveris dedicatedto automotive3 phasebrushlessDC providessix designedto handlegatechargesof 250 nC, and the driversource/sinkcurrentsareprogrammable for ,protectionandmonitoringfeaturesthrougha n boostconverterwithintegratedFETprovidest he overdrivevoltage,allowingfull controlonthe power-stagesevenfor low batteryvoltagedownto (1)PARTNUMBERPACKAGEBODYSIZE(NOM)DRV3201 -Q1 HTQFP(64) (1)

4 For all availablepackages,see the orderableaddendumatthe end of the : DRV3201-Q1 SubmitDocumentationFeedbackCopyright 2017,TexasInstrumentsIncorporated4 Deviceand relateddocumentationsee the following: DRV3201 BoostConverter DRV3201 CurrentSenseAmplifier DRV3201 EVM PowerPAD DocumentationUpdatesTo receivenotificationof documentationupdates,navigateto the deviceproductfolderon the upperrightcorner,clickonAlertmeto registerand receivea weeklydigestof any productinformationthat changedetails,reviewthe revisionhistoryincludedin any followinglinksconnectto TI provided"AS IS" by the not constituteTI specificationsand do not necessarilyreflectTI's views;see TI's E2E OnlineCommunityTI'sEngineer-to-Engineer( E2E)

5 ,you can ask questions,shareknowledge,exploreideasand helpsolveproblemswith 'sDesignSupportQuicklyfind helpfulE2E forumsalongwith designsupporttoolsandcontactinformationf or ,E2E are trademarksof othertrademarksare the propertyof leadsshouldbe shortedtogetheror the deviceplacedin conductivefoamduringstorageor handlingto preventelectrostaticdamageto the TI glossarylists and explainsterms,acronyms,and Mechanical,Packaging,and OrderableInformationThe followingpagesincludemechanical,packagin g,and the mostcurrentdataavailablefor the subjectto changewithoutnoticeand revisionofthis browser-basedversionsof this datasheet,referto the OPTION 1 PACKAGING INFORMATIONO rderable DeviceStatus(1)Package TypePackageDrawingPinsPackageQtyEco plan (2)Lead/Ball Finish(6)MSL Peak Temp(3)Op Temp ( C)Device Marking(4/5)SamplesDRV3201 QPAPQ1 ACTIVEHTQFPPAP64160 Green (RoHS& no Sb/Br)CU NIPDAUL evel-3-260C-168 HR-40 to 125 DRV3201 DRV3201 QPAPRQ1 ACTIVEHTQFPPAP641000 Green (RoHS& no Sb/Br)CU NIPDAUL evel-3-260C-168 HR-40 to 125 DRV3201 (1) The marketing status values are defined as follows:ACTIVE: Product device recommended for new : TI has announced that the device will be discontinued, and a lifetime-buy period is in : Not recommended for new designs.

6 Device is in production to support existing customers, but TI does not recommend using this part in a new : Device has been announced but is not in production. Samples may or may not be : TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substancedo not exceed by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI mayreference these types of products as "Pb-Free".RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS : TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold.

7 Antimony trioxide basedflame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuationof the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options.

8 Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finishvalue exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on informationprovided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken andcontinues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

9 In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual OPTION 2 TAPE AND REEL INFORMATION*All dimensions are nominalDevicePackageTypePackageDrawingPi nsSPQReelDiameter(mm)ReelWidthW1 (mm)A0(mm)B0(mm)K0(mm)P1(mm)W(mm) MATERIALS Materials-Page 1*All dimensions are nominalDevicePackage TypePackage DrawingPinsSPQL ength (mm)Width (mm)Height (mm) MATERIALS Materials-Page (TI) reservesthe rightto makecorrections,enhancements,improvement sand otherchangesto itssemiconductorproductsand servicesper JESD46,latestissue,and to discontinueany productor serviceper JESD48, latestrelevantinformationbeforeplacingor dersand shouldverifythat suchinformationis currentand s publishedtermsof sale for semiconductorproducts( )

10 Applyto the sale of packagedintegratedcircuitproductsthat TI has qualifiedand releasedto applyto the use or sale of othertypesof TI significantportionsof TI informationin TI datasheetsis permissibleonly if reproductionis withoutalterationand isaccompaniedby all associatedwarranties,conditions,limitati ons,and is not responsibleor liablefor thirdpartiesmay be subjectto TI productsor serviceswith statementsdifferentfromor beyondthe parametersstatedby TI for that productor servicevoidsall expressand any impliedwarrantiesfor theassociatedTI productor serviceand is an unfairand is not responsibleor liablefor any otherswho are developingsystemsthat incorporateTI products(collectively, Designers ) understandand agreethat Designersremainresponsiblefor usingtheirindependentanalysis,evaluation and judgmentin designingtheirapplicationsand that Designershavefull and exclusiveresponsibilityto assurethe safetyof Designers' applicationsand complianceof theirapplications(andof all TI productsusedin or for Designers applications)with all applicableregulations,lawsand ,withrespectto theirapplications,Designerhas all the necessaryexpertiseto createand implementsafeguardsthat (1) anticipatedangerousconsequencesof failures,(2) monitorfailuresand theirconsequences,and (3)


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