ELECTRONICS INDUSTRIES Metal Foil for Printed …

1 IPC-4562 AMetal foil for PrintedBoard ApplicationsDeveloped by the Metallic foil Task Group (3-12a) of the Printed BoardBase Materials Committee (3-10) of IPCU sers of this publication are encouraged to participate in thedevelopment of future :IPC3000 Lakeside Drive, Suite 309 SBannockburn, Illinois60015-1249 Tel 847 847 :IPC-4562 with Amendment 1 -May 2005 IPC-4562 - May 2000 IPC-MF-150F - October 1991 ASSOCIATION CONNECTINGELECTRONICS INDUSTRIEST able of Contents1 .. Designation .. Sheet Description .. Metal .. Grade .. Grades .. Metal foil Grades .. Weight and Thickness .. foil Area Weight .. of Foils Other than Copper .. Enhancement Treatment .. Profile .. 22 APPLICABLE .. Standards .. 33 and Definitions.

2 (As Agreed Upon Between Userand Supplier) .. Factor .. Requirements Acceptability .. and .. and Tears .. and Porosity .. Length and Width .. foil .. Metallic Foils .. Weight .. foil .. Metallic foil .. Profile .. Requirements .. Strength .. Ductility .. Release Strength .. Finish .. Requirements .. Cleaning .. Integrity .. for Specific Metal foil .. foil .. foil .. 54 QUALITY ASSURANCE Process Control (SPC) .. for Inspection .. Equipment and Inspection of Samples .. Laboratory Conditions .. Temperature Variation inEnvironmental Chambers .. Conditions .. of Inspections .. Inspection .. of Product for Delivery .. of Qualification .. Conformance Inspection.

3 Conformance Inspection .. Frequencies .. Size .. 7 April Unit .. A Inspection .. Plans for Class 3 Material .. Plans for Class 2 Material .. Plan for Class 1 Material .. Lots .. B Inspection .. Group B .. C Inspection .. Group C .. Methods .. Evaluation of Foils with Carriers .. and Porosity .. of Weight of Foils .. foil with Releasable Carrier .. foil with Etchable Carrier .. Profile .. Strength .. Ductility .. Strength of Thin foil with Carrier .. Between Carrier and foil .. Finish .. Cleaning .. Integrity .. Process Control (SPC) .. 105 PREPARATION FOR .. 106 Data .. 11 APPENDIX A Copper foil 12 TablesTable 1-1 Copper foil Weights and Thickness.

4 2 Table 3-1 Maximum foil 5 Table 3-2 Maximum Resistivity of DepositedFoil (All Types) .. 5 Table 3-3 Maximum Resistivity for Wrought foil (All Weights).. 5 Table 4-1 Quality Conformance 7 Table 4-2 IPC-4562 Sampling 7 Table 4-3 Lot Inspection 8 Table A1 Application Guide for Copper 12 Table A2 Application Guide Hot Rupture Strengthfor Copper foil .. 13 Table A3 Application Guide Rupture Bulge Heightfor Copper foil .. 14 Table A4 Engineering Data Fatigue Ductility* (CIT)**.. 14 IPC-4562 AApril 2008viMetal foil for Printed board Applications1 SCOPEThis specification covers Metal foils supported by carrierfilms and unsupported foils suitable for subsequent use inprinted boards. Unless otherwise agreed upon between userand supplier (AABUS), Metal foilsshallbe consideredacceptable, so long as the requirements in this specificationare PurposeThis specification addresses the require-ments for procurement of Metal foils used only in printedwiring foil DesignationThe foil designationshallbe in thefollowing forms:IPC-4562/XWhere X is thespecificationsheet number(See )2 foil Thickness(See )CUFoil Metal (See )SBondEnhancementTreatment(See )EFoil Type(See )XSFoil Profile(See )3 foil Grade(See )3 QualityClassification(See ) Specification Sheet DescriptionAt the end of thisdocument is a series of specification sheets.

5 Each sheetoutlines engineering and performance data for a Metal sheets are provided with a number for ordering pur-poses. For example, if a user wishes to order from specifi-cation sheet 1, the number 1 would be substituted for the X in the above designation example ( , IPC-4562/1).The Metal foils contained in this standard represent knownmaterials. As new foils become available, they will beadded to future revisions. Users and material developersare encouraged to supply information on new materials forreview by the Metallic Foils Task Group (3-12a). Userswho wish to invoke this specification for Metal foils notlistedshalllist a 0 (zero) for the specification sheet num-ber ( , IPC-4562/0).This specification provides quality classes (see ) for requirements to reflect functional perfor-mance (see Appendix A) and testing properties.

6 The refer-ence of a single class does not preclude invoking specificrequirements defined in other foil MetalThe Metal foilshallbe designated by asuitable two- or three-letter code:CU - CopperNI - NickelXX - foil TypeMetal foil typesshallbe distinguishedby their process of manufacture andshallbe designated as:E - ElectrodepositedW - Wrought (rolled)O - foil foil GradesFoil gradesshallbe distinguishedaccording to the following foil grade designations:1. Standard electrodeposited (STD-Type E)2. High ductility electrodeposited (HD-Type E)3. High temperature elongation electrodeposited(HTE-Type E)5. As rolled-wrought (AR-Type W)7. Annealed-wrought (ANN-Type W)8. As rolled-wrought low temperature annealable(LTA-Type W)9. Nickel, standard electrodeposited10.

7 Electrodeposited low temperature annealable(LTA-Type E)11. Electrodeposited annealable (A-Type E) Other Metal foil GradesOther Metal foil gradeswill be designated as the need foil Weight and Copper foil Area WeightThe area weight andnominal thickness for coppershallbe as identified in Thickness of Foils Other than CopperThick-ness of all other metalsshallbe indicated by dimensions tothe nearest mm [ in]. Bond Enhancement TreatmentThe bondenhancement treatment used on the Metal foilshallbe des-ignated as one of the following:N - No treatment; no stain proofingP - No treatment; stain proofing both sidesS - Single-sided bond enhancement treatment (matte side);stain proofing on both sidesApril 2008 IPC-4562A1